Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology. The Company's products solve critical performance bottlenecks in applications spanning thermal, electrical, and structural use cases. Its breakthrough Liquid Metal ZRT thermal interface material is designed to solve thermal chokepoints that are facing the next generation of AI and HPC silicon. For more information, visit https://www.bomaterials.com/ A career-defining opportunity rarely offers all of the following Direct connection to the mission. Gain a clear understanding of the business and see how your work directly shapes outcomes. With no unnecessary layers, silos, or bureaucracy, every team member contributes meaningfully to the company's success and has the responsibility to drive real impact. Growth beyond a single role. At Boston Materials, you are not defined by your past experience or limited by a job description. Working alongside leading experts in the field, you will take on new challenges, broaden your expertise, develop new capabilities, and take ownership of projects that matter – while contributing to the broader success of the organization. Work on problems that matter. Help solve some of the most pressing challenges in the Advanced Semiconductor, AI Infrastructure, and Advanced Materials industries. Boston Materials offers a rare combination of purpose, autonomy, and impact. We invite you to join us. About the role We are seeking a highly motivated Senior Applications Engineer to serve as the primary technical partner for our customers as they evaluate and adopt our high-performance thermal interface material (TIM) products. This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications. This position offers the opportunity to work closely with hyperscalers, ODMs, and OSATs, and to influence the adoption of cutting-edge thermal solutions in next-generation AI and data center systems. Join us to solve one of the most critical challenges facing the Semiconductor and Electronics Industry – thermal management! Responsibilities Lead internal design and development efforts to integrate our liquid-metal based thermal interface materials into customer-specific electronic packages. Build and test package and provision assembly mockups to demonstrate design feasibility, which may include mechanical and reliability testing. Document designs for both fabrication and customer coordination. Lead effort to fabricate provisions either internally or externally in support of customer schedules. Support R&D team in continuous improvement of system performance. Act as the primary technical point of contact for ODM, OSAT, and hyperscaler customer technical teams during early and mid-stage engagement. Work closely with business development team to uncover and document customer technical requirements, including geometric, load, assembly, environmental constraints, thermal budgets, and reliability standards. Prepare and deliver technical content such as application notes, design guides, and data reports to support customer decision-making and qualification processes. Support customer testing trials, troubleshooting technical issues in real time and coordinating resolution with internal engineering, manufacturing, and quality teams. Capture customer feedback and synthesize insights to guide internal product development and roadmap planning. Requirements Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field. CAD modeling and drafting, hands-on experience prototyping, mechanical and thermal testing, data analysis, and report generation. 3–7 years of experience in semiconductor packaging, electronics assembly, thermal interface materials, or applications engineering in a B2B technical product company. Strong understanding of system-level processor packaging/thermal design (cold plate and stiffener/lid design, TIM1/TIM1.5/TIM2 selection) and associated reliability testing (uHAST, TCT, HTS, etc.). Proven ability to lead cross-functional technical efforts and deliver customer-specific solutions on time. Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders. Experience with design and fabrication of elastomeric materials is a plus. Familiarity with tools such as thermal test setups, C-SAM, X-ray, or FEA modeling is a plus. 10-20% travel to customer sites required. Summary of Benefits Health, Vision & Dental – Boston Materials pays 75% of Health, Vision and Dental Care coverage for employee and dependents Unlimited Paid Time Off Holidays: 14 days/year
