Develop software, automation scripts, and data acquisition tools (e.g., Python) to control test equipment, log telemetry, perform real-time monitoring, and analyze large reliability datasets
Perform hands-on debugging and electrical characterization to drive root cause and corrective action of silicon, package, and interconnect failures observed in reliability testing, production, or the field
Utilize advanced diagnostic and test tools (oscilloscopes, power supplies, vector network analyzers, custom firmware/scripts, thermal chambers, etc.) to characterize devices under stress and isolate failure mechanisms
Run reliability failure investigations, coordinating efforts across silicon design, packaging, manufacturing, and reliability teams, and communicating findings to leadership
Analyze reliability data (Weibull, acceleration models, etc.) to predict field performance, document failure modes, and drive design/process improvements for higher yield and reliability
Partner with design, packaging, software, test, and manufacturing engineering teams to deliver reliable silicon hardware by informing product design, package selection, process changes, and test coverage
BASIC QUALIFICATIONS
Bachelor’s degree in electrical engineering, electronics engineering, or other engineering discipline
PREFERRED SKILLS AND EXPERIENCE
1+ years of experience in semiconductor reliability, packaging reliability, consumer electronics, aerospace, automotive, or similar high-reliability industry
Masters degree or PhD in electrical engineering, electronics engineering, or a related field with a focus on semiconductors, characterization, or test
Hands-on experience with HTOL or other accelerated life tests for packages or TDDB, EM, HCI, and other wafer-level tests
Experience developing or procuring custom test hardware, burn-in boards, sockets, or fixturing for reliability testing
Experience designing PCBs for test fixtures or high-reliability applications
Familiarity with programming and automation/scripting languages (Python preferred; C++, SQL, or similar) for test control, data logging, and analysis
Proficiency in understanding PCB schematics, layout tools, and electrical interfaces for semiconductor packages
Knowledge of JEDEC (JESD22), AEC-Q200/AEC-Q100, MIL-STD-202/883, IPC, or related reliability standards and physics-of-failure methods
Experience in a fast-paced, iterative design/manufacturing environment within semiconductor, consumer electronics, aerospace, automotive, or related industries
ADDITIONAL REQUIREMENTS
Ability to work overtime and weekends as needed
ITAR REQUIREMENTS
To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.
