Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs
Enabling TI MCM modules package competitiveness through adopting the industry latest greatest capabilities and maximize package design flexibility for adapting the latest technology.
Work with multi function to enable stress modeling to understand the package design weak point and define the contingency plan to overcome it.
Minimum requirements
Bachelor’s Degree in Mechanical Engineering, Physics, Material Science, or a related field of study
Cumulative > 3.3 CGPA and above
Minimum 5 years-experience in the manufacturing semiconductor field
Expert level experience in process development for power stage, multi chip module
Package layer design expertise such as structural configuration, material selection and process flow design
Hands on skills in operating machines and knowledge to down-select material, process optimization and yield improvement
Expert experience of using ANSYS / FEA for stress modeling
Preferred qualifications
Ability to engage with a geographically diverse team with a strategic vision to drive a complex technology roadmap.
Hands on experience on system-in-Package (SiP), including multi chip package or package on package is added advantage.
Knowledge of power stage packaging design, including understanding of Design for Manufacturability (DFM) constraints and defect criteria.
Experience in multi-process coordination and optimization (integration between SMT and back-end packaging processes)
Ability to establish strong and collaborative relationships with stakeholders, global design & manufacturing teams and component/material/substrate supplier to meet on-time execution
Broad and deep technical understanding of leadframe / DBC / MIS manufacturing.
Knowledge in FMEA methodology, process control plan, statistical analysis, SPC and DOE methodology. Skilled in JMP statistical analysis software is an added advantage
Experience with assembly of power modules packaging, substrate design and reliability requirements
Project management experience in semiconductor industry specifically in Assembly Test or SMT Operation
Key personal characters – trustworthy, inclusive, innovative, competitive, result-oriented
