Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems. The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈⬛ . In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously! We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together! About the role We are seeking a Senior Integration & Yield Engineer to join the Foundries & Process Integration team within the Quantum Hardware & Infrastructure department. The role sits at the interface between qubit design and the chip manufacturing teams. Its purpose is twofold: ensure that device designs translate reliably into high-performing fabricated circuits, and provide the data foundation for process improvement decisions. You will own yield monitoring across our fabrication flows, lead the analysis of fabrication and test data, and maintain the interfaces between design and manufacturing — supporting the scale-up from tens of qubits to a few hundred, and enabling our path toward fault-tolerant quantum computing. Responsabilities Yield engineering & data analysis Own yield monitoring across fabrication flows: define metrics, build automated dashboards (wafer reports), and provide real-time visibility of fab performance and yield. Lead root cause analysis of systematic and random yield detractors, in collaboration with the chip manufacturing teams. Perform advanced statistical analysis (using Python/JMP) to ensure process stability and control variability. Develop strategies to reduce inductance/frequency non-uniformity within and across wafers, improving the consistency of qubit performance (frequency targeting, coherence times). Process Integration Define and maintain robust integration flows of POR (process of reference), ensuring design-to-fab alignment. Establish Design for Manufacturability (DFM) guidelines. Document and maintain reference fabrication flows, yield dashboards, and process KPIs to support process reviews. Design-to-fabrication interface Own the look-up tables (LUT) linking design parameters to Josephson junction fabrication, and maintain their accuracy as fabrication processes evolve. Test and implement Design Rule Manual (DRM) extensions in collaboration with the design and fabrication teams, and establish Design for Manufacturability (DFM) guidelines. Translate device designs into fabrication-ready wafer layouts (wafer layout generation), and develop Python-based tools to automate the design-to-wafer pipeline and reduce manual handoff errors. Failure analysis coordination & continuous improvement Coordinate the investigation of device failures at room and cryogenic temperatures using electrical test data, inline metrology, and advanced microscopy (SEM, AFM). Lead corrective and preventive actions using structured problem-solving methodologies (5 Whys, Ishikawa). Requirements Master's degree or Ph.D. in Physics, Materials Science, or a related field. 3+ years of hands-on experience in semiconductor or superconducting circuit nanofabrication or process integration. Proven expertise in yield engineering, SPC, DOE, and statistical analysis tools. Proficiency in Python scripting to adapt and extend tools connecting design and fabrication workflows. Strong problem-solving mindset and command of root cause analysis methodologies (5 Whys, FMEA, Ishikawa). Excellent communication skills and the ability to work effectively in a cross-disciplinary environment. Experience in the fabrication or characterization of superconducting circuits, or in cryogenic testing is a plus. Recruitment Process Screening Call with Alexandra, Talent Acquisition Specialist (30 min) Hiring Manager Interview with Alireza (45 min) Technical Interview/Presentation with the Team (120 min) Leadership Team Interview (45 min) Fit Interview (45 min) Reference check
