Splunk
From Splunk's careers page
Status: listed on the employer's own careers page when we last checked (daily). Confirm on their site before applying.
Take on the role of FA Engineering Technical Leader, leading electrical and physical failure analysis for advanced packaging ASIC products.
Take on the role of FA Engineering Technical Leader, leading electrical and physical failure analysis for advanced packaging ASIC products. Oversee complex failure mechanisms and collaborate with cross-functional teams to resolve critical issues. Ideal for experienced engineers with strong expertise in semiconductor fault isolation and advanced packaging reliability.
Skills: electrical failure analysis, physical failure analysis, root cause analysis, semiconductor device physics, package failure analysis, fault isolation techniques, reliability investigation, advanced packaging technologies, fib, sem, tem, x-ray, csam, atpg, mbist, emmi, obirch, sil, lsm, 2.5d packaging, 3d packaging, flip chip packaging, wlp, fowlp, foplp, hybrid bonding, tsv, high-density substrate technologies, jedec reliability qualification standards, thermal cycling
A free account lets you apply, save this job, see how well you match and check your resume against it.
Scores your resume against this job the way resume scanners do: the job's hard and soft skills, searchability, recruiter tips and formatting.
Create a free account to see your score. Your resume stays in this browser until then, and we never store it.
Already a member? Sign in