Leverage subject matter expertise in package architecture, high-density interconnect package design, as well as performance, reliability, and cost constraints.
Apply hands-on experience in packaging assembly processes, materials, equipment, and adherence to design rules.
Collaborate with and manage multiple foundries and OSATs to advance packaging solutions from concept to full-scale production.
Lead cross-functional teams and manage multiple concurrent programs.
Resolve complex technical issues encountered throughout the development and manufacturing process.
Preferred Qualifications
M.S. or Ph.D. in Mechanical, Electrical, or Materials Engineering, or equivalent experience.
Seventeen or more years of hands-on experience in packaging technology development, specifically in 2.5D/3D for high-density die-to-die (D2D) interconnects, RDL, fan-out bridges, FCBGA, MCM, and related disciplines.
Comprehensive understanding of semiconductor industry packaging trends, end-user packaging requirements, and prior experience with high-performance computing products.
Familiarity with reliability standards, test methods, qualification procedures, and failure analysis techniques.
Knowledge of substrate manufacturing processes and design rules.
Excellent verbal and written communication skills.
Demonstrated ability in organized technical project management.
Ability to work independently and lead multiple programs simultaneously.
Proven capability to lead multi-functional teams and resolve complex technical problems.
Familiarity with working alongside contract manufacturers (CM) on data center and rack design is considered an advantage.
Minimum Qualifications
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
- OR
- Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
- OR
- PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.
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Pay range and Other Compensation & Benefits
$210,000.00 - $315,000.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
