Skills
As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:
Proficient in Cadence APD & SiP and/or Siemens Xpedition Package Designer (xPD).
Familiar in using Constraint Manager in Package design tool for setting up DFM rules and electrical rules
Experience in using in-line DRC checking, DFM verification, Electrical Rule Checking (ERC) preferred.
Basic knowledge in signal-integrity for high-speed IO interfaces, transmission line & electromagnetic field theory.
Knowledge of IC packaging structures, chip-package, and package-board interaction.
Basic knowledge of electronic packaging process and typical failure modes preferred.
Preferred Qualifications
Master's degree in electrical engineering, mechanical engineering, material science, or related fields with 5+ years of experience.
Proven fundamentals in electrical, material, thermal, or mechanical engineering fields.
Familiarity with various sophisticated package configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.).
Experience in package design and proficiency in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP).
Basic understanding of some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
Basic knowledge of substrate manufacturing process, structure, design rules, and material properties.
Proven understanding of high-speed interfaces, including DDR, PCIe, UCIE, etc.
Experience with Calibre tool and package design reviews.
Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs).
Solid understanding of Design Rules Check and Design for Manufacturing.
Minimum Qualifications
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
- OR
- Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
- OR
- PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.
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