onsemi
From onsemi's careers page
Status: listed on the employer's own careers page when we last checked (daily). Confirm on their site before applying.
Lead the development, qualification, and manufacturing release of advanced flip-chip packaging solutions, including substrate-based (FC-BGA, FC-LGA) and leadframe-based technologies. Drive package development from concept through production while working closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, reliable, and cost-effective products.
Lead package development activities from concept, design, qualification, and production release.
Develop and optimize substrate-based and leadframe-based flip-chip package technologies.
Drive package architecture, material selection, assembly process development, and manufacturability improvements.
Support flip-chip integration, including bumping, underfill, reflow, molding, and singulation process optimization.
Develop qualification plans and assess package reliability performance.
Lead root-cause investigations and corrective actions for package, assembly, and reliability issues.
Collaborate with OSATs and suppliers on process development, yield improvement, and cost reduction initiatives.
Support NPI execution and transfer technologies into high-volume manufacturing.
BS/MS in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
8+ years of semiconductor package development experience.
Flip-chip packaging technologies
FC-BGA and FC-LGA packages
FC-QFN, FC-DFN, DrMOS, and SPS packages
Leadframe and substrate packaging processes
Package reliability and qualification
Knowledge of DOE, DFMEA, SPC, 8D, and statistical problem-solving methodologies.
Experience working with OSATs, substrate suppliers, and material vendors.
Strong technical leadership and project management skills.
Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
Proven ability to lead projects across organizations and cultures in a fast-paced environment.
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