onsemi
From onsemi's careers page
Status: listed on the employer's own careers page when we last checked (daily). Confirm on their site before applying.
Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages. Responsible for package architecture, substrate design, flip-chip integration, passive component assembly, reliability qualification, and manufacturing readiness. Collaborate closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, cost-effective power packaging solutions.
Lead package development from concept through production release.
Define package architecture, materials selection, and assembly process flow.
Develop and optimize substrate designs including stack-up, routing, power planes, via structures, and thermal features.
Drive flip-chip integration, bump design, underfill selection, and assembly process optimization.
Develop passive component integration strategies for capacitors, resistors, and magnetic components.
Perform electrical, thermal, and mechanical performance optimization.
Lead package qualification and reliability testing per JEDEC and IPC standards.
Conduct root cause analysis and implement corrective actions for package failures.
Collaborate with OSATs and suppliers on DFM, process development, yield improvement, and cost reduction.
Support NPI execution and transfer technologies into high-volume manufacturing.
BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
10+ years of semiconductor package development experience.
Multi-Phase Power Modules, DrMOS, and SPS packaging
Advanced substrate design and manufacturing
Flip-chip assembly and package integration
Passive component assembly and optimization
Thermal management and reliability engineering
High-volume manufacturing and NPI processes
Experience working with OSATs, substrate suppliers, and material vendors.
Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
Proven ability to lead projects across organizations and cultures in a fast-paced environment.
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