Define and own NPD reliability and robustness requirements for power semiconductor products.
Lead reliability assessments for advanced power packaging technologies (e.g., sintered die attach, copper clip/ribbon, embedded die, power modules, double‑sided cooling).
Analyze chip–package interaction effects and thermo‑mechanical failure mechanisms and propose design, process, or material improvements
Influence package, device, and process design decisions through data‑driven reliability recommendations.
Lead technical reliability discussions to align stakeholders on risk, tradeoffs, and qualification strategy.
Design and execute power cycling, thermal cycling, and accelerated thermo‑mechanical stress tests.
Develop, validate, and calibrate lifetime and acceleration models based on physics of failure and test data.
Conduct early‑stage FMEA and drive RCCA for reliability stress failures.
Collaborate with internal labs on reliability testing and failure analysis.
Correlate accelerated stress results to customer mission profiles and application use conditions.
Communicate complex reliability data, physics‑of‑failure insights, and risk assessments clearly to technical and non‑technical stakeholders.
Manage multiple projects in a fast‑paced, cross‑functional environment.
Recent graduate (or will graduate by end of year) with PhD in Electrical Engineering, Materials Science, Mechanical Engineering will be considered.
MS with 3–5 years of relevant experience.
Strong understanding of physics of failure, particularly electro‑thermo‑mechanical mechanisms in semiconductor devices and packages.
Proven experience with chip–package interactions, package materials, and assembly processes.
Hands‑on experience with power cycling reliability testing and accelerated thermo‑mechanical stress.
Experience with power semiconductor products (Si, SiC, GaN discrete devices and/or power modules).
Proficiency with structured problem‑solving tools (FMEA, 8D, root cause analysis).
Experience with statistical analysis tools (JMP, Minitab) and MS Office.
Experience in extracting data, creating reports and dashboards using Power BI, Python, Oracle and/or SQL is a plus.
Knowledge of industry reliability standards (JEDEC, AEC, IEC, MIL, AQG324) preferred.
Experience working with automotive customers/OEMs is a plus.
Willingness to travel (<10%).
Excellent verbal and written communication skills in English.
