At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Senior Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.
What you'll be doing
Lead adhesive and bonding process development for advanced FCBGA packaging, including surface preparation, surface coatings and process optimization for applications requiring optical alignment and high dimensional stability.
Design and execute Design of Experiments (DOE) for adhesive material qualification, process window definition, and process optimization including failure analysis.
Evaluate and qualify new materials (adhesives, encapsulants, underfills) from vendors including characterization of cure chemistry, thermal stability, and mechanical properties
Define and own incoming material acceptance criteria and statistical process control (SPC) thresholds for production readiness
Collaborate with partners and material suppliers to resolve process escapes, drive 8D corrective actions, and align on specification requirements
Prepare process documentation, assembly specs, and material qualification reports
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Monitor and analyze production data to identify process trends, drive yield improvements, and ensure ongoing process control across OSAT manufacturing sites.
What we need to see
B.Sc. or M.Sc. in Materials Science, Chemical Engineering, or a related field
7+ years of experience in process engineering, with hands-on expertise in adhesive process development.
Proven experience with failure analysis techniques: cross-sectioning, SEM/EDX, optical microscopy, DSC, TGA, and FTIR
Willingness and ability to travel internationally approximately 30% of the time to support OSAT partners, supplier qualifications, and on-site failure investigations
Ability to work independently in a fast-paced, multi-program environment
Curious and creative problem solver as well as organized and multi-tasker
Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)
High awareness of quality, manufacturability and project schedule
Ways to stand out of the crowd
Proven record in packaging development
Background in semiconductor manufacturing processes and optical systems
