Key Responsibilities
Manufacturing & Sustaining Engineering Execution
Support sustaining engineering across semiconductor package assembly technologies and product lines.
Execute high-volume manufacturing improvement activities related to yield, cycle time, quality, throughput, and cost.
Develop and maintain engineering practices for process control, defect reduction, and continuous improvement.
Contribute technical input to assembly engineering roadmaps aligned with package technology and business needs.
Work with Package Engineering and OSAT teams to ensure manufacturable designs and robust production controls.
Yield Monitoring & Continuous Improvement
Monitor assembly yield performance, trends, and corrective action progress.
Execute data-driven yield improvement initiatives using statistical and structured problem-solving methodologies.
Investigate process, reliability, and customer quality issues through disciplined root-cause analysis.
Maintain KPIs and dashboards to track manufacturing performance and engineering effectiveness.
Quality & Reliability Management
Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
Support containment, corrective, and preventive actions for manufacturing and field quality issues.
Ensure process controls and qualification requirements are maintained across OSAT sites.
Support customer, supplier, and internal quality audits and reviews.
Work with manufacturing partners to resolve issues early and ensure shipment of qualified products.
Process Change Management
Support process change management for materials, equipment, tooling, flows, and sites.
Assess engineering changes for technical, quality, reliability, supply, and operational impact.
Develop and execute qualification plans for transfers, second sourcing, equipment changes, and cost reductions.
Maintain disciplined documentation, change control, and manufacturing readiness processes.
NPI to High Volume Manufacturing Ramp
Serve as a manufacturing engineering interface for NPI-to-production transfers.
Drive manufacturability reviews and package-process integration during product development.
Support manufacturing readiness, process optimization, and structured ramp execution for new products.
Ensure process, qualification, material, site, and capacity readiness for high-volume ramp.
Coordinate ramp execution with cross-functional engineering, supply chain, and quality teams.
OSAT Partner Management
Coordinate with global OSAT and contract manufacturing partners supporting development and production.
Track partner performance related to yield, quality, cycle time, reliability, and capacity.
Participate in technical reviews, audits, benchmarking, and qualification assessments for manufacturing partners.
Collaborate with suppliers and OSAT partners on transfers, optimization, scaling, and cost improvement.
Team Collaboration & Technical Capability Development
Provide technical guidance and day-to-day support to assembly engineering team members.
Promote collaboration, technical discipline, accountability, and continuous improvement within the team.
Help strengthen engineering processes and technical capabilities to support evolving business and technology needs.
Support technical mentoring, knowledge sharing, and capability growth within the engineering organization.
Contribute packaging assembly expertise to support product execution, customer readiness, and manufacturing ramp.
Qualifications
Required Qualifications
Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline.
15+ years of semiconductor manufacturing and packaging engineering experience with strong exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers.
3+ years of experience leading technical projects, mentoring engineers, or managing small engineering teams in semiconductor manufacturing environments.
Strong expertise in semiconductor package assembly and related processes including FET wafer metallization processing, thin die processing, wirebond, clip attach, flip chip, solder die attach, reflow, molding, package singulation, package buffing/grinding, die embedding, and SMT.
Deep understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools.
Experience working with global OSAT partners and outsourced manufacturing ecosystems, including benchmarking, selection, qualification, and ongoing technical management of subcontractors and contract manufacturers.
Demonstrated experience supporting successful NPI-to-HVM product ramp execution.
Strong knowledge of semiconductor quality systems, change management, and qualification methodologies.
Excellent analytical, organizational, communication, and cross-functional collaboration skills.
Preferred Qualifications
Master’s degree or PhD in Engineering or related field.
Experience with advanced packaging technologies for power packages, such as SiP/modules, multi-chip modules, Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages are essential. Wafer-level packaging and substrate-level packaging design and technology knowledge are a strong plus. Wide-bandgap packaging knowledge for SiC and GaN dies including knowledge of DBC, AMB, and advanced interconnect technologies are highly valued. 2.5D/3D packaging, fan-out, embedded die, and heterogeneous integration will also gain points.
Familiarity with automotive, AI/data center infrastructure power, high-performance computing, power semiconductor, and wide-bandgap product manufacturing requirements.
Experience working with geographically distributed engineering teams and global manufacturing operations.
Knowledge of reliability standards including JEDEC, IPC, and customer qualification requirements.
Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
