Micross Components
From Micross Components's careers page
Status: listed on the employer's own careers page when we last checked (daily). Confirm on their site before applying.
Micross is seeking a Semiconductor Package Design Engineer to work in our Apopka, Florida or Raleigh, North Carolina facility.
The primarily responsible for design of advanced semiconductor packages, including both ceramic and organic substrates, including layout, parasitic extraction, and optimization
Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates
Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stack up
Work with IC design team to define IC package requirements
Design package layout using standard CAD tools
Extract package parasitics and conduct PI/SI analysis
Documentation and release in appropriate archival system
Allegro Package Designer Plus (APD+) tools for designing the package and generating artwork for fabrication.
Celsius PowerDC (IR Drop)
Sigrity Advanced SI II: Analysis tools for Signal integrity of parallel busses (DDRx) and serial links (PCIe Gen x), including Package and PCB effects
Sigrity Advanced PI II: Power Integrity tools (IR drop, Impedance Profile, capacitor optimization) including Package and PCB effects
RF / Microwave Design
AWR, Momentum and HFSS Software Circuit, system, and EM simulation for RF/microwave product development
Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline.
8 to 10 years of experience in semiconductor packaging design, modeling, and simulations
Strong authority on Cadence Allegro Package Designer Plus (APD+)
Experience on interposer and substrate layouts and design in advanced package technologies
Experience with design teams on floor plan, bump and layout optimization
Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated
Record of success in cross-functional team environment
Good experience with SI/PI tools for package level extraction/simulation
At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.
Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.
www.Micross.com
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