Translate device, patterning, and integration requirements into measurable film properties, process specifications, and manufacturable deposition solutions
Design and implement experiments and DOEs to identify process mechanisms, sources of variation, defectivity, and interactions between incoming materials, substrates, deposition conditions, and downstream processing
Establish relationships between process conditions, film properties, patterning and integration behavior, electrical performance, yield, and reliability
Drive thin-film concepts from feasibility through integration and demonstration in relevant semiconductor test structures and process flows
Partner with patterning, etch, metrology, process integration, equipment, device, and supplier teams to solve complex cross-module engineering problems
Evaluate new deposition technologies, materials, precursors, and process capabilities using data-driven and physics-based decision-making
Provide technical leadership by defining development direction, communicating technical recommendations, and mentoring engineers across multidisciplinary teams
Minimum Qualifications
A Bachelor’s degree or equivalent experience in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, Physics, or a related technical team, along with more than 6 years in the semiconductor industry
Hands-on experience developing and owning semiconductor deposition techniques involving ALD, CVD, PECVD, PEALD, or similar thin-film methods
Strong understanding of thin-film deposition fundamentals, surface/reaction mechanisms, material properties, and semiconductor process integration
Proven ability to independently move a complex process-development problem from root-cause investigation through DOE, experimental validation, data analysis, and technical recommendation
Experience collaborating across semiconductor process modules and technical teams to resolve process, defectivity, integration, yield, or reliability challenges
Preferred Qualifications
Experience developing dielectric, hard-mask, spacer, insulating, etch-selective, or electrically functional thin films for advanced semiconductor applications
Experience integrating new materials or deposition processes into advanced semiconductor process flows or test structures
Hands-on experience with characterization techniques such as XPS, AFM, XRD, AES, ellipsometry, TEM/SEM, EBSD, SIMS, or related methods
Experience correlating material and process behavior with patterning, defectivity, electrical performance, yield, or reliability
Experience using AI-assisted analytics to enhance data interpretation, anomaly detection, process optimization, or yield-improvement activities
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
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