Partner with equipment suppliers and vendors to define and execute equipment and process development roadmaps.
Work across 300mm deposition platforms, including current single-wafer ALD and CVD systems.
Minimum requirements
Master’s degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
5+ years relevant experience in 300mm Advanced (<32nm) logic device or advanced memory device technologies
Working knowledge of Process development, characterization and control of Thin films processing equipment, CVD, PE-CVD, Single-wafer ALD
Strong supplier engagement skillset
Strong foundation in statistical process control, Design of Experiments (DOE), data analysis, model-based problem solving, engineering change control, and process release strategies
Preferred qualifications
5 years relevant experience in 300mm Advanced logic of advanced memory device technologies: Specific experience on RMG products
Working knowledge of advanced CMOS device physics and reliability mechanisms
Hands on Process Experience across multiple 300mm deposition platforms for dielectric, High-K and Metals
Experience with Single-wafer ALD such as ASM XP4 Pulsar & XP8 platforms, as well as Batch ALD platforms
Familiarity with 300mm Semiconductor Single wafer Thermal, RTA, Laser Anneal systems
Direct R&D experience in 300mm semiconductors
Experience with HKMG, Silicon Photonics
Device physics training with understanding of materials, material evolution; structural characterization and electrical test characterization
Data analysis skills
Ability to work in teams and collaborate effectively with people in different functions and locations
Strong relationship-building, communication, time management, and results-oriented collaboration skills to enable on-time project delivery
