Responsibilities
Lead technical integration projects for new memory and advanced packaging technologies
Design and complete experiments to assess process performance, variability, reliability, and yield
Solve complex integration issues using data from inline, defect, parametric, probe, reliability, and package-level testing
Partner across Process Integration, Process Development, Device Engineering, Package Design, Product Engineering, Reliability, Materials, and Manufacturing to develop and qualify new technologies
Apply AI tools to data analysis, experiment planning, documentation, and technical problem-solving
Minimum Qualifications
BS in Electrical/Chemical/Mechanical Engineering, Materials Science & Engineering, Physics, or a related technical field with 5+ years semiconductor experience; MS in a related field with 4+ years of semiconductor experience; or PhD and 2+ years of semiconductor experience.
Experience delivering technical results in process integration, process development, or device development, including experiment design, execution, and analysis
Knowledge of semiconductor process integration and memory technologies such as DRAM, NAND, and/or emerging memory architectures
Experience solving technical problems using data-driven methods such as statistical analysis, Design of Experiments (DoE), and root-cause analysis
Experience leading technical projects, collaborating across functions, communicating complex technical information, and using AI tools to improve technical workflows
Preferred Qualifications
Experience with advanced packaging technologies such as wafer-level packaging, fan-out packaging, 2.5D/3D integration, TSV, microbump, bonding, or chiplet integration
Experience with Wafer-Level Technology or reconstituted wafer flows, including die shift, warpage, thickness/TTV, edge integrity, defectivity, or handling
Experience developing, qualifying, and transferring semiconductor processes or integration solutions to high-volume manufacturing, including multi-site development
Experience with device or package reliability and test methodologies, including probe, final test, burn-in, stress testing, or reliability qualification
Experience applying AI or machine-learning tools to engineering data analysis, anomaly detection, yield improvement, or other engineering workflows
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
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