Establish the site-wide preventive maintenance (PM) strategy, standards, and schedules; review and approve team-executed PM plans, aligned with IE.
Lead root-cause analysis (RCA) for major / repeated equipment failures; drive long-term corrective actions and monitor effectiveness.
Coordinate critical-complex equipment maintenance with suppliers: contract negotiation, schedule management, on-site supervision, and technical acceptance.
Write and approve SOPs / operating procedures for critical complex equipment owned by the team.
Own the spare parts strategy: critical-parts identification, safety stock settings, inventory turns, and cost optimization; regularly review stock levels to balance downtime risk vs. working capital.
Evaluate and qualify spare parts suppliers; lead cost-saving negotiations for high-volume or high-value spare parts.
Define, track, and report equipment KPIs: uptime / availability, MTBF, MTTR, OEE, maintenance cost per hour, spare parts turnover.
Lead cross-functional cost-reduction and quality-improvement projects on bottleneck equipment; drive breakthroughs at equipment level.
Manage departmental maintenance and spare parts budget: planning, forecasting, approval of purchases, and variance analysis.
Review and approve equipment qualification plans (mechanical manufacturing / assembly machines) and verify manufacturer-stated capabilities.
Evaluate emerging equipment and maintenance technologies; propose trials and lead adoption where ROI is justified.
Serve as the escalation point for the team on technically complex equipment issues that cannot be resolved at Engineer level.
REQUIRED QUALIFICATIONS
Bachelor's degree or above in Electrical Engineering and Automation / Electronic Information Engineering / Mechanical Engineering; age below 45; male preferred.
At least 8 years of equipment maintenance experience in semiconductor, optoelectronics, or electronic communication industries, with a minimum of 2 years in a supervisor / lead role managing a team of 3 or more engineers.
Deep knowledge of die bonder, wire bonder, AA equipment, laser welding and laser cut, coating machine, dicing machine, oven and chamber, fusion splicer, optical instruments, and assembly equipment.
Strong failure analysis and root-cause problem-solving; hands-on capability on PLC, MCU, analog / digital circuits, and board-level repair.
Familiarity with EAM / CMMS systems (e.g. SAP PM, Maximo) and ISO / IPC / industry quality standards.
Demonstrated team leadership: hiring, performance management, coaching, conflict resolution, and developing junior engineers.
Proven project management skills: scope, schedule, budget, risk management across cross-functional stakeholders.
Data-driven mindset: comfortable defining KPIs, analyzing metrics, and presenting findings to senior management.
Good English reading, writing, and oral communication ability is required (daily use in a bilingual environment).
Willingness to learn and take ownership; strong hands-on capability; excellent team spirit and communication; ability to work under pressure and meet tight deadlines.
We are an equal opportunity employer and value diversity at our company.
We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.
We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment.
Please contact us to request accommodation.
