Key Responsibilities
Hands-on technical supervision: Direct daily maintenance activity while personally assisting with complex diagnostics, repairs, calibrations, equipment recovery, and safe return-to-production.
Team leadership: Assign priorities, balance workloads, establish shift and on-call coverage, coach technicians, verify work quality, and develop technical capability through equipment-specific qualification and cross-training plans.
Process-equipment ownership: Lead maintenance support for equipment used in epitaxy, wet and dry etch, thin-film deposition, diffusion and thermal processing, ion implantation, photolithography, wafer cleaning, plating, metrology, inspection, wafer thinning, dicing, and related fab operations.
Compound-semiconductor equipment: Support specialized InP/GaAs tools and subsystems involving toxic, pyrophoric, corrosive, and hazardous process materials, including process chambers, gas panels, chemical delivery interfaces, vacuum systems, point-of-use abatement, robotics, controls, and safety interlocks.
Silicon-fab equipment: Sustain 8-inch silicon processing tools in a production environment through disciplined troubleshooting, maintenance execution, recovery, and obsolescence planning.
Preventive and predictive maintenance: Develop and execute maintenance plans based on equipment criticality, process risk, condition, manufacturer guidance, failure history, and production schedules; improve PM effectiveness through data analysis.
Corrective maintenance and escalation: Lead structured fault isolation for mechanical, electrical, electronic, software, robotics, motion-control, RF, vacuum, thermal, chemical, gas-delivery, and instrumentation issues; coordinate supplier escalation when needed.
Production recovery: Prioritize tool-down response, establish containment and recovery plans, communicate estimated restoration timing, and confirm maintenance completion before process qualification and release.
Work management: Control work orders, backlog, labor planning, lockout/tagout, parts, vendor activities, maintenance procedures, calibration records, equipment logs, and post-maintenance verification through the site CMMS and approved systems.
Safety and compliance: Enforce hazardous-energy control, electrical safety, chemical and gas safety, radiation or laser controls where applicable, cleanroom protocols, job hazard analyses, and equipment-specific safe-work procedures.
Equipment installations and upgrades: Support tool selection, design reviews, installation, hookup coordination, acceptance testing, commissioning, decommissioning, relocation, and production handoff; ensure maintainability and service requirements are addressed.
Reliability improvement: Lead root-cause analysis, corrective actions, bad-actor equipment reviews, and reliability projects to improve uptime, mean time between failures, mean time to repair, process stability, maintainability, and cost of ownership.
Spare parts and supplier management: Establish critical-spares strategies, address obsolete components, manage repairable assets, evaluate service performance, and control maintenance spending within approved budgets.
Documentation and change control: Maintain accurate procedures, schematics, equipment configurations, software versions, maintenance history, and change records; ensure modifications follow approved management-of-change requirements.
Communication: Provide clear shift handoffs, tool-status updates, risk assessments, maintenance schedules, performance reports, and executive-level summaries to fab stakeholders.
Qualifications
Required Qualifications
Associate degree, technical certificate, military technical training, or equivalent combination of education and relevant semiconductor-equipment experience.
Typically 7 or more years of progressive experience maintaining semiconductor processing equipment in wafer fabrication or a similarly complex high-technology manufacturing environment.
Typically 2 or more years of lead, supervisory, or work-coordination experience.
Demonstrated ability to troubleshoot process tools and subsystems involving mechanical assemblies, electrical and electronic controls, PLCs, computers, robotics, motion control, RF power, vacuum, pneumatics, temperature control, chemical delivery, gas delivery, sensors, and instrumentation.
Working knowledge of cleanroom protocols, contamination control, lockout/tagout, hazardous-energy control, and safe maintenance of equipment using hazardous chemicals and gases.
Experience with CMMS work management, equipment maintenance metrics, calibration, spare-parts control, supplier escalation, technical documentation, and written maintenance procedures.
Ability to interpret schematics, piping and instrumentation diagrams, mechanical drawings, software diagnostics, alarm histories, equipment manuals, and operating data.
Ability to participate in an after-hours on-call rotation and respond to critical tool-down events.
Strong written, verbal, organizational, and cross-functional leadership skills.
Preferred Qualifications
Bachelor’s degree in engineering, engineering technology, or a related technical field.
Direct equipment-maintenance experience in both compound-semiconductor and silicon wafer fabrication.
Experience supporting epitaxy, plasma etch, wet processing, PVD, CVD, PECVD, diffusion furnaces, rapid thermal processing, ion implant, lithography tracks and steppers, metrology, inspection, plating, wafer thinning, or dicing equipment.
Experience with process-tool gas panels, chemical-delivery modules, vacuum systems, RF generators and matching networks, robotics, servo systems, PLCs, industrial computers, point-of-use abatement, and equipment safety interlocks.
Formal training or certification in electrical safety, vacuum technology, controls, robotics, reliability, maintenance management, or hazardous materials.
Experience leading tool installations, relocations, upgrades, factory or site acceptance testing, commissioning, and equipment lifecycle or obsolescence programs.
Knowledge of semiconductor equipment safety and environmental requirements, including applicable SEMI guidance and site standards.
Leadership and Technical Competencies
Safety leadership and operational discipline
Hands-on technical credibility and sound judgment under pressure
Work prioritization, delegation, coaching, and accountability
Structured troubleshooting and root-cause problem solving
Risk assessment, change control, and contingency planning
Reliability improvement and data-driven decision-making
Clear communication across technical, operational, and leadership audiences
Collaboration in 24/7 manufacturing environments
Working Conditions and Physical Requirements
This position works primarily on-site in semiconductor cleanrooms, equipment chases, service areas, and maintenance shops. Work may require cleanroom garments and personal protective equipment; standing, bending, kneeling, reaching, climbing approved access platforms, and working around process equipment in restricted service spaces; and lifting or moving items within company-established limits. The supervisor may encounter noise, hazardous energy, vacuum systems, heated components, chemicals, compressed or toxic process gases, lasers, RF energy, radiation sources, and automated motion under controlled conditions. Shift flexibility, planned maintenance coverage, and emergency call-in support are required. Reasonable accommodations will be provided in accordance with applicable requirements.
Measures of Success
Safe maintenance execution with effective hazard controls and timely closure of corrective actions
Process-tool availability, mean time between failures, mean time to repair, response time, and recovery performance
Preventive maintenance completion, schedule adherence, calibration compliance, and backlog health
Reduction in repeat failures and measurable improvement from root-cause corrective actions
Successful tool installations, upgrades, relocations, qualifications, and production handoffs completed to scope and schedule
Technician qualification, equipment cross-training, technical depth, engagement, and retention
Critical-spares availability, obsolescence-risk reduction, supplier performance, and responsible budget management
Accurate equipment documentation, change control, audit readiness, and strong partnership with operations, engineering, EH&S, and facilities interfaces
Pay Range
USD $122,040.00 - USD $203,400.00 Year
Careers Privacy Statement***Keysight is an Equal Opportunity Employer.***
Semiconductor Equipment Maintenance Supervisor
3-Inch InP/GaAs Fab and 8-Inch Silicon Fab
Position Summary
The Semiconductor Equipment Maintenance Supervisor is a hands-on working supervisor responsible for the safe, reliable, and compliant maintenance of semiconductor processing equipment supporting a 3-inch indium phosphide/gallium arsenide (InP/GaAs) compound-semiconductor fab and an 8-inch silicon fab. The role leads equipment maintenance technicians and service providers while actively supporting advanced troubleshooting, preventive and corrective maintenance, equipment recovery, upgrades, installations, and lifecycle planning. The supervisor partners with Equipment Engineering, Process Engineering, Manufacturing Operations, Environmental Health and Safety (EH&S), suppliers, and facilities interfaces to maximize tool availability, process capability, and production readiness across both fabs. This role does not own base-building or central facility systems.
Key Responsibilities
Hands-on technical supervision: Direct daily maintenance activity while personally assisting with complex diagnostics, repairs, calibrations, equipment recovery, and safe return-to-production.
Team leadership: Assign priorities, balance workloads, establish shift and on-call coverage, coach technicians, verify work quality, and develop technical capability through equipment-specific qualification and cross-training plans.
Process-equipment ownership: Lead maintenance support for equipment used in epitaxy, wet and dry etch, thin-film deposition, diffusion and thermal processing, ion implantation, photolithography, wafer cleaning, plating, metrology, inspection, wafer thinning, dicing, and related fab operations.
Compound-semiconductor equipment: Support specialized InP/GaAs tools and subsystems involving toxic, pyrophoric, corrosive, and hazardous process materials, including process chambers, gas panels, chemical delivery interfaces, vacuum systems, point-of-use abatement, robotics, controls, and safety interlocks.
Silicon-fab equipment: Sustain 8-inch silicon processing tools in a production environment through disciplined troubleshooting, maintenance execution, recovery, and obsolescence planning.
Preventive and predictive maintenance: Develop and execute maintenance plans based on equipment criticality, process risk, condition, manufacturer guidance, failure history, and production schedules; improve PM effectiveness through data analysis.
Corrective maintenance and escalation: Lead structured fault isolation for mechanical, electrical, electronic, software, robotics, motion-control, RF, vacuum, thermal, chemical, gas-delivery, and instrumentation issues; coordinate supplier escalation when needed.
Production recovery: Prioritize tool-down response, establish containment and recovery plans, communicate estimated restoration timing, and confirm maintenance completion before process qualification and release.
Work management: Control work orders, backlog, labor planning, lockout/tagout, parts, vendor activities, maintenance procedures, calibration records, equipment logs, and post-maintenance verification through the site CMMS and approved systems.
Safety and compliance: Enforce hazardous-energy control, electrical safety, chemical and gas safety, radiation or laser controls where applicable, cleanroom protocols, job hazard analyses, and equipment-specific safe-work procedures.
Equipment installations and upgrades: Support tool selection, design reviews, installation, hookup coordination, acceptance testing, commissioning, decommissioning, relocation, and production handoff; ensure maintainability and service requirements are addressed.
Reliability improvement: Lead root-cause analysis, corrective actions, bad-actor equipment reviews, and reliability projects to improve uptime, mean time between failures, mean time to repair, process stability, maintainability, and cost of ownership.
Spare parts and supplier management: Establish critical-spares strategies, address obsolete components, manage repairable assets, evaluate service performance, and control maintenance spending within approved budgets.
Documentation and change control: Maintain accurate procedures, schematics, equipment configurations, software versions, maintenance history, and change records; ensure modifications follow approved management-of-change requirements.
Communication: Provide clear shift handoffs, tool-status updates, risk assessments, maintenance schedules, performance reports, and executive-level summaries to fab stakeholders.
Required Qualifications
Associate degree, technical certificate, military technical training, or equivalent combination of education and relevant semiconductor-equipment experience.
Typically 7 or more years of progressive experience maintaining semiconductor processing equipment in wafer fabrication or a similarly complex high-technology manufacturing environment.
Typically 2 or more years of lead, supervisory, or work-coordination experience.
Demonstrated ability to troubleshoot process tools and subsystems involving mechanical assemblies, electrical and electronic controls, PLCs, computers, robotics, motion control, RF power, vacuum, pneumatics, temperature control, chemical delivery, gas delivery, sensors, and instrumentation.
Working knowledge of cleanroom protocols, contamination control, lockout/tagout, hazardous-energy control, and safe maintenance of equipment using hazardous chemicals and gases.
Experience with CMMS work management, equipment maintenance metrics, calibration, spare-parts control, supplier escalation, technical documentation, and written maintenance procedures.
Ability to interpret schematics, piping and instrumentation diagrams, mechanical drawings, software diagnostics, alarm histories, equipment manuals, and operating data.
Ability to participate in an after-hours on-call rotation and respond to critical tool-down events.
Strong written, verbal, organizational, and cross-functional leadership skills.
Preferred Qualifications
Bachelor’s degree in engineering, engineering technology, or a related technical field.
Direct equipment-maintenance experience in both compound-semiconductor and silicon wafer fabrication.
Experience supporting epitaxy, plasma etch, wet processing, PVD, CVD, PECVD, diffusion furnaces, rapid thermal processing, ion implant, lithography tracks and steppers, metrology, inspection, plating, wafer thinning, or dicing equipment.
Experience with process-tool gas panels, chemical-delivery modules, vacuum systems, RF generators and matching networks, robotics, servo systems, PLCs, industrial computers, point-of-use abatement, and equipment safety interlocks.
Formal training or certification in electrical safety, vacuum technology, controls, robotics, reliability, maintenance management, or hazardous materials.
Experience leading tool installations, relocations, upgrades, factory or site acceptance testing, commissioning, and equipment lifecycle or obsolescence programs.
Knowledge of semiconductor equipment safety and environmental requirements, including applicable SEMI guidance and site standards.
Leadership and Technical Competencies
Safety leadership and operational discipline
Hands-on technical credibility and sound judgment under pressure
Work prioritization, delegation, coaching, and accountability
Structured troubleshooting and root-cause problem solving
Risk assessment, change control, and contingency planning
Reliability improvement and data-driven decision-making
Clear communication across technical, operational, and leadership audiences
Collaboration in 24/7 manufacturing environments
Working Conditions and Physical Requirements
This position works primarily on-site in semiconductor cleanrooms, equipment chases, service areas, and maintenance shops. Work may require cleanroom garments and personal protective equipment; standing, bending, kneeling, reaching, climbing approved access platforms, and working around process equipment in restricted service spaces; and lifting or moving items within company-established limits. The supervisor may encounter noise, hazardous energy, vacuum systems, heated components, chemicals, compressed or toxic process gases, lasers, RF energy, radiation sources, and automated motion under controlled conditions. Shift flexibility, planned maintenance coverage, and emergency call-in support are required. Reasonable accommodations will be provided in accordance with applicable requirements.
Measures of Success
Safe maintenance execution with effective hazard controls and timely closure of corrective actions
Process-tool availability, mean time between failures, mean time to repair, response time, and recovery performance
Preventive maintenance completion, schedule adherence, calibration compliance, and backlog health
Reduction in repeat failures and measurable improvement from root-cause corrective actions
Successful tool installations, upgrades, relocations, qualifications, and production handoffs completed to scope and schedule
Technician qualification, equipment cross-training, technical depth, engagement, and retention
Critical-spares availability, obsolescence-risk reduction, supplier performance, and responsible budget management
Accurate equipment documentation, change control, audit readiness, and strong partnership with operations, engineering, EH&S, and facilities interfaces
Pay Range
USD $122,040.00 - USD $203,400.00 Year
Careers Privacy Statement***Keysight is an Equal Opportunity Employer.***
