Qualifications
Minimum Qualifications
Diploma in Electronic/ Electrical Engineering or a related field.
six months or more years of work experience in Semiconductor field related to design of silicon packaging or PCB.
Novice to intermediate proficiency in substrate design and development, including physical layout and routing.
Basic understanding of I/O fundamentals, package interconnect, and power delivery principles.
Familiarity with design for manufacturability (DFM) and quality assurance processes.
Strong problem-solving skills with a disciplined approach to execution.
Preferred Qualifications
Preferred experience into E-CAD tool.
Effective communication skills to convey technical information and collaborate with cross-functional teams.
A proactive mindset to identify design improvement opportunities and ensure alignment with project goals.
Passion for driving innovation and contributing to complex engineering challenges.
This is your opportunity to be part of Intel's legacy of innovation while developing your skills and advancing your career. Apply now and help us shape the future of technology.
Job Type
College Grad
Shift
Shift 1 (India)
Primary Location
India, Bangalore
Additional Locations
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
