US: $159000 - $230000 (USD) + 15% bonus target + equity + benefits
Learn more about benefits at Google.
Design, architect, and implement novel packaging platforms.
Investigate and characterize electrical, thermal, and mechanical properties of packaging materials.
Develop and document new process flows and Design-For-Integration (DfI) principles for emerging technologies.
Lead technical engagements with external vendors and partners to evaluate, co-develop, and qualify next-generation packaging processes and components outside of the current standard manufacturing processes.
Conduct root cause analysis and develop mitigation strategies for performance-limiting factors (e.g., yield, reliability, signal integrity) unique to those new technologies.
Minimum qualifications
Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
5 years of experience in 3 of the following areas of packaging development: simulation, layout and design, process engineering, assembly, test and measurement, failure analysis.
5 years of experience with one or more of the following technologies: 2.5D/3D integration, wafer level packaging, panel level packaging, bump bonding.
3 years of experience delivering R&D concepts to a released product.
3 years of experience developing advanced packaging solutions.
Preferred qualifications
Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
Experience in a semiconductor packaging environment.
Experience using simulation tools to evaluate electrical/RF, thermal, or mechanical performance of packaging structures and guide new designs.
Familiarity with quantum computing hardware architectures and the specific constraints they impose on packaging design.
Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
5 years of experience in 3 of the following areas of packaging development: simulation, layout and design, process engineering, assembly, test and measurement, failure analysis.
5 years of experience with one or more of the following technologies: 2.5D/3D integration, wafer level packaging, panel level packaging, bump bonding.
3 years of experience delivering R&D concepts to a released product.
3 years of experience developing advanced packaging solutions.
