The Day-to-Day
Own and support CMP (Chemical Mechanical Planarization) and wafer grinding processes for Silicon Carbide (SiC) wafer manufacturing.
Partner closely with Production, Equipment Engineering, Quality, and Operations teams to resolve manufacturing issues and support daily production priorities.
Investigate and respond to process excursions, out-of-control (OOC) conditions, yield losses, and equipment-related issues using structured problem-solving methodologies.
Drive continuous improvement initiatives focused on process capability, yield, throughput, cycle time, cost reduction, and manufacturing quality.
Analyze process and equipment data using Statistical Process Control (SPC) and other engineering analysis techniques to identify opportunities for improvement.
Develop, qualify, and implement process changes while ensuring adherence to safety, quality, and change-management requirements.
Lead process qualifications, equipment installations, acceptance activities, and technology transfers for new manufacturing equipment and processes.
Partner with Equipment Engineering to optimize preventive maintenance strategies and improve tool uptime and reliability.
Create, maintain, and improve manufacturing specifications, procedures, work instructions, and best-known methods.
Lead cross-functional projects from concept through implementation while meeting schedule, quality, and business objectives.
Support root cause investigations and corrective/preventive actions (CAPA) using data-driven decision making.
Provide technical leadership and mentorship within areas of process ownership.
Minimum Requirements
Bachelor’s degree in Engineering is required (Materials Engineering, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or related engineering discipline).
2+ years of engineering experience in a manufacturing environment.
Experience troubleshooting process and equipment issues using structured engineering methodologies.
Strong analytical and problem-solving skills with the ability to make data-driven decisions.
Experience using Statistical Process Control (SPC), Design of Experiments (DOE), data analysis, or process characterization techniques.
Demonstrated ability to identify opportunities, manage change, and successfully implement process improvements.
Strong written and verbal communication skills with the ability to effectively collaborate across multiple organizations.
Ability to work independently, manage multiple priorities, and thrive in a fast-paced manufacturing environment.
Willingness to provide occasional off-hours support for critical manufacturing or equipment issues.
Preferred Qualifications
Semiconductor manufacturing experience, particularly in advanced materials processing or high-volume manufacturing environments.
Direct experience with Chemical Mechanical Planarization (CMP), wafer grinding, polishing, lapping, thinning, surface finishing, or substrate processing technologies.
Experience working with Silicon Carbide (SiC), advanced ceramics, or related engineered materials.
Knowledge of process qualification, equipment acceptance, process control plans, and manufacturing change management.
Experience with root cause analysis methodologies such as 8D, DMAIC, FMEA, Fishbone, or Fault Tree Analysis.
Familiarity with manufacturing data analysis tools such as JMP, Minitab, Power BI, or similar platforms.
Experience leading cross-functional improvement projects with measurable business results.
We are an equal opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, national origin, disability status, protected veteran status, or any other characteristic protected by law.
