Coherent
From Coherent's careers page
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Drive new product and new process development to ensure timely and successful delivery of qualified products.
Oversee day-to-day progress of matrix lots to keep development activities on track.
Manage part numbers and BOM to ensure proper setup for new product introduction.
Support the NPI team in establishing mask sets, process flows, and workflows for both front-end (wafer fabrication) and back-end (die assembly and characterization) processes.
Assist in failure analysis by investigating issues found during wafer fabrication and product characterization and take the lead in analyzing root causes.
Coordinate production ramp-up readiness by working closely with cross-functional teams—including EPI, process, assembly, test, and product engineering—to ensure readiness in areas such as chip design/specs, equipment, process documentation, and data infrastructure.
Collaborate with the product engineering team to improve yield, especially in addressing characterization issues that span multiple process areas.
Design and execute experiments related to design, process, and testing to identify and implement corrective actions for failure modes encountered during new product development.
3 years of experience in III-V semiconductor laser related device design, process
development and characterization is required.
PhD degree in electrical engineering, material science, physics, or other relevant
major.
Hands-on experience with design, process and characterization of optoelectronic device such as VCSEL, DFB laser, or photonic integrated chip.
Strong statistical data analysis skills (JMP or Minitab etc.).
Familiarity with semiconductor wafer fab operations (Manufacturing Execution System, process and quality control, change management etc.).
Experience with optoelectronic device reliability testing and modeling is a plus.
Strong communication skills; adept at hosting effective meetings and facilitating actions and resolving conflicts.
Strong ability to drive actions and solutions through cross-functional teams.
Collaborate in a professional and respectful manner with coworkers, vendors, contractors, etc.
Oversee new product and process development, ensuring timely qualification and launch.
Manage day-to-day progress of development activities, keeping projects on track.
Support NPI team in establishing mask sets, process flows, and workflows for front-end and back-end processes.
Lead failure analysis, investigating issues during fabrication and characterization.
Coordinate production ramp-up with cross-functional teams, ensuring readiness in all areas.
Collaborate with product engineering to improve yield and address characterization issues.
Design and execute experiments to identify and correct failure modes.
Manage part numbers and BOM for new product introductions.
Ensure proper setup and documentation for smooth transition to manufacturing.
PhD in Electrical Engineering, Material Science, Physics, or related field.
3+ years of experience in III-V semiconductor laser device design, process development, and characterization.
Hands-on experience with optoelectronic device design, process, and characterization (VCSEL, DFB laser, etc.).
Strong statistical data analysis skills (JMP, Minitab, etc.).
Familiarity with semiconductor wafer fab operations and processes.
Experience with optoelectronic device reliability testing is an asset.
Excellent communication skills, able to lead meetings and resolve conflicts.
Proven ability to drive cross-functional teams and actions.
Professional and respectful collaboration with colleagues and external partners.
Ability to work in a cleanroom environment and with hazardous materials.
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