Select and bring in new testers, handlers, and active thermal controllers (ATCs).
Work with vendors to maintain lab equipment.
Test hardware development
Drive development of final test and probe hardware, working with PCB designers, probe vendors, and socket vendors.
Debug and bring up test hardware on the ATE.
Optimization and release
Reduce test time and improve yield without affecting product quality.
Troubleshoot failure mechanisms with cross-functional teams.
Release test programs to the production team in Asia and collaborate with them.
Work with CMs to improve yield on existing products
What You'll Bring
Required
Hands-on experience with Teradyne UltraFlex tester platforms.
Ability to independently develop test programs, including complex flows.
Programming experience for test method development.
Experience debugging and troubleshooting failure mechanisms with cross-functional teams.
Volume data analysis skills, including correlating ATE failures with system-level failures, and proficiency with data analysis software or languages.
Understanding of how test hardware affects chip behavior at the ATE.
Experience with extreme-temperature testing of ASICs at ATE.
Ability to lead and mentor other engineers.
Preferred
Experience setting up or expanding an ATE lab, including equipment selection and vendor management.
Experience with AI tools for quick script development.
Education and Experience
Bachelor's degree with 8+ years of related experience, or
Master's degree with 6+ years of related experience
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
