Key Responsibilities
Lead process integration for advanced semiconductor and photonic devices, enabling next-generation high-performance interconnect technologies
Translate device architectures and design layouts into robust, manufacturable process flows across development and pilot manufacturing
Drive C&F activities, including rapid proof-of-concept and prototyping builds
Define and track critical process parameters and integration metrics; partner with module owners to optimize unit processes
Own end-to-end integration flow execution, including process definition, build scheduling, risk assessment, and readiness
Drive yield improvement, SPC, and CIP across complex fabrication flows
Conduct optical, electrical, and tolerance analyses to improve device efficiency, scalability, and manufacturability
Collaborate cross-functionally with process engineering, product development, design, and production teams to accelerate technology development
Engage with external vendors, partners and customers to support technology development, material selection, and process scaling
Minimum Qualifications
Ph.D. in Electrical Engineering, Materials Science, Physics, or related discipline (Master’s degree with relevant industry experience will be considered)
Strong experience in semiconductor process integration in leading fab / foundry
Solid understanding of semiconductor unit processes including lithography, etch, thin film deposition, metallization, implant, CMP, etc.
Strong experience in yield analysis, metrology, and SPC implementation
Experience with simulation and design tools, such as: Cadence, KLayout, AutoCAD, SolidWorks, COMSOL, ANSYS
Proven ability to work effectively in matrixed, cross-functional teams
Preferred Qualifications
Experience in photonic devices, co-packaged optics (CPO), or optical interconnect technologies
Background in advanced packaging and heterogeneous integration
Key Competencies
Demonstrated depth in building, debugging, and optimizing device integration flows.
Strong innovation mindset with the ability to develop novel, out-of-the-box integration solutions to complex technical challenges.
Proven ability to influence and align stakeholders without direct authority across diverse functional teams.
Clear and structured communication of complex integration challenges, trade-offs, and solutions to both technical and non-technical audiences.
Strong discipline in process documentation, change management, and data-driven decision-making
Additional Information
Time Type
Full time
Employee Type
Assignee / Regular
Travel
Yes, 10% of the Time
Relocation Eligible
Yes
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.
