Apple
Packaging Assembly Engineer
- Republic of, South Korea · On-site
- Salary not published
- Posted 6 months ago
From Apple's careers page
Status: listed on the employer's own careers page when we last checked (daily). Confirm on their site before applying.
About the role
Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.
What they ask for vs. your profile
Must have
- Manufacturing