Cross-Functional Collaboration: Partner with Epi, Lithography, Spacer Films, and CMP teams to ensure seamless integration of wet modules into the full 28nm SiGe and silicidation fabrication flow
Metrology & Characterization: Utilize SEM, TEM, ellipsometry, and AFM to characterize surface roughness and etch profiles at atomic resolution
This role requires the ability to manage multiple parallel workstreams under schedule pressure, lead technical discussions with authority, communicate status and risks clearly, and drive alignment across organizational boundaries in a fast-paced technology development environment.
Minimum requirements
Master’s or Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or related field
5+ years in R&D semiconductor wafer fabrication for advanced nodes (28nm or below)
Technical depth in
SiGe device physics, surface preparation, and chemical reaction kinetics
Wet etch chemistries across a broad range of film types
Hands-on experience with single-wafer or batch wet process tools (LAM, TEL, SCREEN, or equivalent)
Design of Experiments (DOE) methodology
Leading cross-functional teams from concept to production-ready status
Preferred qualifications
Experience developing new wet process modules from the ground up
Strong inline-to-end-of-line signal correlation and process characterization skills
Ability to build and maintain stakeholder relationships across internal and external partners
Strong verbal and written communication skills
Demonstrated ability to ramp quickly on new systems and processes
