Foster a culture of technical excellence, innovation, accountability, and continuous improvement
Advanced Process Development
Lead process development and optimization across all process modules including Photolithography, CVD, PVD, Diffusion, Plasma Etch, CMP, and other relevant unit processes
Define and execute process integration strategies for TI's most advanced analog technology nodes
Drive innovative process solutions that meet performance, reliability, and manufacturability requirements
Own technical problem-solving and root cause resolution for complex, cross-module process challenges
Program Execution & Timeline Management
Enable multiple concurrent technology development programs, balancing resources and priorities to meet aggressive milestones
Support program schedules, clearly communicating status, risks, and mitigation plans to site and executive leadership
Drive cross-functional execution across process engineering, integration, device engineering, equipment, and operations teams to ensure on-time technology delivery
Develop scalable engineering workflows and operational frameworks that improve program velocity and team effectiveness
Cross-Functional Collaboration & Executive Engagement
Partner with integration, yield, device, and operations teams to ensure seamless technology transfer and process readiness
Provide regular program updates, technology development status, and risk assessments to site leadership
Represent the section in cross-site and corporate-level technology forums, benchmarking activities, and best-practice sharing initiatives
Minimum requirements
Bachelor's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field.
5 years of direct engineering team leadership or management experience within the semiconductor industry.
Preferred qualifications
Broad process module experience spanning multiple unit process areas within an advanced wafer fabrication environment
Experience leading technology development for analog, mixed-signal, or specialty semiconductor technologies
Familiarity with process integration and technology transfer to high-volume manufacturing
Track record of delivering new technology nodes or process generations on schedule and to performance specifications
Experience in 300mm wafer fabrication environments
Experience supporting multi-site or corporate-level technology benchmarking and governance
Strong cross-functional collaboration, communication, and project management skills
Proven ability to engage and present program and technology updates to site and executive leadership