The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.
Why This Role Matters
Your modeling expertise will directly impact TI's next-generation products, from automotive to industrial to embedded applications. You will work at the intersection of process, device physics, and circuit design, solving complex challenges and delivering cutting edge solutions.
Ready to model the future? Apply today.
Minimum requirements
Ph.D./Masters in Electrical Engineering or related field
5+ years in compact (SPICE) RF modeling for HBT/BJT and CMOS
Preferred qualifications
Expert-level experience with RF characterization, modeling, and circuit-level validation for s-parameters, noise figure, linearity, IMP3/IP3, and harmonic distortion
Strong understanding of RF test-structures, layouts, and calibration/de-embedding techniques
Experience with models (BSIM, MEXTRAM, HICUM, MVSG-GAN, ASM) and parameter extraction tools (ICCAP, BSIMPROPLUS, MBP, etc.)
Deep understanding of semiconductor physics and circuit analysis
Proficiency in EDA tools (Cadence), SPICE simulators (Spectre) and Verilog-A
Programming skills in MATLAB/Python
Strong data analysis skills with AI/ML expertise and TCAD experience are highly valued
