Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements
Participate in data analysis and problem resolution
Work onsite and be responsive to evening and weekend escalations as needed
Data collection, simulation, and on silicon verification of Optical Proximity Correction (OPC) models and recipes
Feedback Sub-Resolution Assist Features (SRAF) design optimizations to the Reticle Enhancement Technology (RET) team
Minimum Requirements
Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Physics, or a related engineering degree
3 years of engineering experience working in a Semiconductor Fab environment within Photolithography
Strong foundation in statistical process control, engineering change control and process release strategies
Preferred Qualifications
Experience with 28nm and below
Demonstrated strong analytical and problem-solving skills including model-based problem solving
Excellent communication and collaboration skills
Ability to work in teams and collaborate effectively with people in different functions
Strong time management skills that enable multitasking and on-time project delivery
Demonstrated ability to build strong, influential relationships
Ability to work effectively in a fast-paced and rapidly changing environment
Ability to take the initiative and drive for results
Proven ability to drive results, prioritize tasks, and manage time to meet project deadlines
Work experience with Source Mask Optimization (SMO) and SRAF optimization
Work experience with the following OPC modeling packages: Prolith, Brion, Synopsys, and Mentor Graphics.
Programing experience in Unix