Responsibilities
Judge potential product quality issues through customer system/application level analysis
Develop and enhance local bench verification capabilities/tools for broad TI devices, and verify customer returns on bench timely
Perform remote and onsite debug support to isolate non-conforming behavior of TI component
Provide EOS and TNI debug support
Work closely with customers to replicate and diagnose failures, and understand application environments and failure scenarios
Collaboration with FA (Failure Analysis) teams to confirm root causes
Driving quality improvement programs with customers
Conduct trainings, workshops and work proactively with customers on failure avoidance, failure diagnosis and safe launch
Minimum requirements
Bachelors degree in Electrical Engineering, Physics or related engineering fields of study
Cumulative 3.0/4.0 GPA or higher
Fresh graduates or graduates with less than 2 years working experience
Qualifications/Skills
MS in electrical engineering or equivalent
Broad experience with TI products, especially FPD-Link, BMS, high voltage gate driver, isolated amplifiers, LED and audio portfolios
Experience/understanding of applications boards, schematics and layouts with hands-on experience in oscilloscopes, logic analyzers, and bench testing
Knowledge of semiconductor FA technology, semiconductor manufacturing process and automotive industry standard/requirement
Knowledge of PCB design, signal integrity, and failure analysis methodologies
Excellent analytical problem-solving skills
Excellent customer communication abilities, and global cross-functional team’s collaboration
Fluent in English
