Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.
As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.
Put your talent to work with us as a Packaging engineer !
Minimum Requirements
Bachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering or related
Cumulative 3.0/4.0 GPA or higher
Preferred Qualifications
Basic understanding of statistical process control (SPC)
Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA)
Demonstrated analytical and problem solving skills
Strong written and verbal communication skills
Ability to work in teams and collaborate effectively with people in different functions
Strong time management skills that enable on-time project delivery
Ability to build strong, influential relationships
Ability to work effectively in a fast-paced and rapidly changing environment
Ability to take the initiative and drive for results
Texas Instruments will not sponsor job applicants for visas or work authorization for this position.
