TE Connectivity
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At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.
Job Overview
PCB Staff Simulation Engineer is a senior technical leader in high speed PCB simulation team in Digital Data Networks (DDN) business of TE Connectivity, responsible for developing new ideas, methods and solutions, providing technical guidance, directions and measurable inputs to dept objectives and goals supporting business strategies, and serving as an advisor for technical roadmaps of the function involving electrical and thermal simulations for ensuring high standards for performance, reliability, and manufacturability before prototyping and mass production at competitive cost. Staff Engineer is expected to be influential leaders, even without formal management authority, possessing strong technical expertise, problem-solving skills, and the ability to drive innovation and ensure product quality. They network with customers/external partners/suppliers/universities/professional associations to acquire new functions, knowledge and expertise. They perform work without appreciable direction. They drive results primarily through collaboration and influence and exercise considerable latitude in determining objectives and approaches to assignment.
Job Requirements
A bachelor’s degree in electrical or electronics engineering from a premier institute/university. A master’s degree in a related field is preferred. Consistent performance throughout entire academics (e.g. STD-X onwards). Experience: Around 8~10 years of extensive hands-on experience in high-speed PCB simulation, with a proven track record of successfully delivering complex projects with deadlines. Deep functional and foundational knowledge on printed circuit board layout, libraries and schematics, routing and manufacturability. Technical Skills: Expertise with simulation tools for high-speed electrical and thermal analysis Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS. Deep understanding of high-speed digital design principles, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents. Strong understanding of PCB design and layout tools such as Cadence Allegro, Altium Designer, or Siemens PADS. Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).
Job Responsibilities
Roles and responsibilities Development of Solutions: develop new ideas, methods and solutions for signal integrity, power integrity, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents. Manage workload, project allocation, and career growth for team members. Simulation Methods and Practices: define and implement simulation methodologies and best practices for accuracy, efficiency, optimizations and recommendations across all PCB simulation projects. Technical guidance: provide technical direction to simulation engineers on simulation tasks and result interpretations on signal integrity (SI) for high-speed interfaces like DDR and PCIe, power integrity (PI) for efficient power delivery, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal management. Provides training and mentorship to less-experienced employees. Simulation review and validation: review simulation inputs, results and analysis providing strategic recommendations to optimize PCB performance and reliability. Cross-functional collaboration: collaborate with colleagues/peers, global hardware, mechanical, and manufacturing teams to understands the interrelationships of different disciplines and translate product requirements into viable PCB simulations. Explain effectively to cross-functional teams, customers and suppliers on simulation results and risks. Continuous improvement: Drive innovation and improvement in the PCB simulation process. Stay current with emerging technologies, design standards (e.g. IPC), and simulation tools to enhance efficiency and maintain a competitive edge. Quality Metrics: Provide direction and guidance on accuracy in simulations, design of experiments (DoE), plausibility check and sensitivity study of simulations, cross-correlation of simulation results with experimental results, and design optimizations for first time right manufacturability (prototypes and mass production).
Competencies
Values: Integrity, Accountability, Inclusion, Innovation, Teamwork
88P, Sahasra Shree
Bangalore, Karnātaka 560066
India
Bangalore
India
Less than 10%
141503
Onsite
Engineering & Technology
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TE Connectivity does not accept unsolicited assistance from third parties for employment opportunities. All CVs/resumes submitted to any TE employee by a third party without a valid written search agreement for that specific position will not be entitled to any form of compensation and such submission shall be deemed the sole property of TE. No fee will be paid in the event an individual is hired by TE regardless of any third party submission where no pre-existing written search agreement is in place. If an agency agreement is in place, submissions are position specific. General submissions not targeted at a specific employment opportunity will not be entitled to any form of compensation. Please, no phone calls or emails. © 2023 TE Connectivity Corporation. All Rights Reserved.
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