Key Responsibilities
Technical Leadership & Customer Engagement
Serve as the primary technical liaison for TE’s customers, actively engaging with hyperscalers, OEMs, and system architects to gain deep insights into next-gen compute, AI, storage, and networking challenges.
Proactively identify and assess technology disruptors, translating emerging trends into strategic R&D initiatives and product development roadmaps to maintain TE’s industry leadership.
Cultivate and strengthen customer partnerships, fostering co-development opportunities and collaborative innovation to accelerate next-gen infrastructure advancements.
Drive thought leadership by educating and influencing internal and external stakeholders, from executives and product teams to key decision-makers in customer organizations, on emerging industry trends, TE’s technical capabilities, and high-value engineering solutions.
Bridge the gap between customer needs and TE’s technology roadmap, ensuring TE delivers future-proof, scalable, and high-performance interconnect solutions tailored to the evolving datacenter landscape.
System-Level Architecture & Product Strategy
Define high-level system architecture requirements, ensuring TE’s product roadmap is aligned with next-generation compute, AI, and networking ecosystems.
Drive TE’s technology vision and strategy, ensuring our interconnect solutions support the evolving needs of standards like OSFP, QSFP-DD, COBO, and standards set by OIF and IEEE, particularly as they relate to AI/ML workloads and next-generation data center architectures.
Lead the evaluation of high-speed electrical, optical, and hybrid interconnect solutions, balancing performance, power, latency, cost, and manufacturability.
Collaborate with internal R&D, product development, and business units to shape product development roadmaps based on real-world customer challenges and market trends.
Drive technical due diligence for potential partnerships, acquisitions, and ecosystem collaborations, ensuring TE stays at the forefront of innovation.
Co-Packaged and Near-Package Optics Architecture Leadership
Drive the design and system architecture of co-packaged optics (CPO) or near-packaged (NPO) solutions, integrating optical interconnects tightly with high-radix ASIC subsystems to enable ultra-high bandwidth and low-latency data transmission.
Define novel, scalable CPO/NPO architectures to meet future performance, power, and density demands of AI, ML, and hyperscale workloads.
Architect CPO/NPO systems across optical, electrical, thermal, and mechanical domains.
Conduct end-to-end simulations and modeling to optimize signal integrity, power efficiency, and thermal performance.
Evaluate emerging materials, photonic integration techniques, and semiconductor technologies to maintain a competitive advantage in CPO/NPO innovation.
Industry and Customer Engagement
Represent TE in customer discussions and industry forums as a subject matter expert in co-packaged optics.
Collaborate with hyperscalers, OEMs, and ecosystem partners to influence and align around roadmap development and optical interface standards
Cross-Functional Leadership & Execution
Partner with ASIC, package, board, and photonics engineering teams to ensure CPO/NPO solutions are manufacturable, scalable, and aligned with system architecture requirements.
Work cross-functionally with engineering, product management, sales, and marketing teams to translate technical insights into compelling product offerings.
Drive the execution of high-impact, innovative technical projects, ensuring seamless alignment between customer needs, business goals, and engineering capabilities.
Guide TE’s go-to-market strategy for new interconnect solutions, ensuring that our technical differentiation is clearly communicated and leveraged in competitive landscapes.
What your background should look like
Bachelor’s degree or higher in Optical Engineering, Electrical Engineering, Mechanical Engineering, or Physics with 12+ years’ experience in the optical design.
Technical expertise in high-speed optical engineering and design.
Knowledge of compute, networking, AI / ML, and storage architectures.
Experience in data center compute and/or networking industry system design and related technologies.
Hands-on experience in the design and testing of optical transceivers and optical components. Silicon Photonics background is HIGHLY desired.
Effectively able to build relationships with external customers and industry leaders as well as internally across all levels, disciplines, and geographies.
Strategic minded with a proven ability to translate industry and technical trends into meaningful strategies for the business.
Outstanding communication and presentation skills. A convincing communicator with compelling perspectives that drive engagement and excitement both up and down the organization, with an ability to clearly communicate technical concepts to diverse audiences.
Demonstrates sound judgment in working through complex technical issues with an ability to communicate actions and impact clearly to stakeholders, including management, customers, and the technical community.
Ability to spend 25%-50% of your time traveling domestically and internationally
#LI-REMOTE
Competencies
Values: Integrity, Accountability, Inclusion, Innovation, Teamwork
COMPENSATION
Competitive base salary commensurate with experience: $154,100 – $231,100 (subject to change dependent on physical location)
Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
Total Compensation = Base Salary + Incentive(s) + Benefits
Job Locations
United States
Posting City
#
Job Country
United States
Travel Required
10% to 25%
Requisition ID
136143
Workplace Type
Remote
External Careers Page
Engineering & Technology
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