Your commitment to continuous learning and innovation drives you to stay updated with emerging trends and technologies. You approach every project with a can-do attitude and demonstrate adaptability, resilience, and a relentless pursuit of excellence. You are excited by the opportunity to make a significant impact at Synopsys, contributing to groundbreaking products that shape the future of technology.
What You’ll Be Doing
Collaborating with cross-functional teams during early design stages to optimize and define SIPI (Signal Integrity/Power Integrity) performance requirements, including bump mapping and power estimation.
Designing and developing advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages.
Modeling and analyzing advanced package designs to ensure optimal electrical, thermal, and mechanical performance.
Representing Synopsys on business unit projects as a technical leader and subject matter expert in advanced packaging.
Resolving a wide range of design and integration issues using creative, data-driven approaches.
Supporting customer engagements in exploring and implementing advanced package solutions with Synopsys IPs.
Collaborating with global teams to share best practices and drive innovation in advanced packaging methodologies.
The Impact You Will Have
Empowering Synopsys and its customers to deliver next-generation, high-performance silicon solutions.
Accelerating the adoption of advanced packaging technologies that enable new levels of integration and energy efficiency.
Enhancing the performance, reliability, and manufacturability of Synopsys IP test chip packages.
Driving technical excellence and innovation in business unit projects that define Synopsys’ leadership in the semiconductor industry.
Mentoring and guiding engineering peers, fostering a culture of knowledge sharing and continuous improvement.
Setting new industry standards for quality, performance, and innovation in advanced package design.
Building and strengthening customer relationships through expert support and collaboration.
What You’ll Need
Bachelor’s degree in Electrical or Electronic Engineering (Master’s or PhD preferred).
Minimum of 10 years’ relevant experience in advanced package design, model extraction, and analysis.
Expert knowledge of advanced circuit and transmission line theory.
Hands-on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies.
Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, Electromagnetic, etc.).
Familiarity with both Windows and Linux operating systems.
Experience with industry-standard EDA tools such as Cadence APD, Innovus, Integrity-3DIC, Synopsys ICC2, 3DIC Compiler, and Fusion Compiler.
Who You Are
A creative problem solver with strong analytical and critical thinking skills.
An excellent communicator, able to explain technical concepts to diverse audiences.
A collaborative team player who values inclusivity, diversity, and shared success.
Adaptable, quick to learn, and enthusiastic about adopting new technologies and methodologies.
Detail-oriented, quality-driven, and committed to continuous improvement and innovation.
Self-motivated with a strong sense of ownership and accountability.
The Team You’ll Be A Part Of
Join a global, highly skilled, and supportive team dedicated to advancing the forefront of package design and integration. Our team works closely with R&D, product management, and customer engineering groups to foster innovation, technical excellence, and open communication. Together, we tackle some of the most complex challenges in the semiconductor industry, supporting each other’s growth and celebrating our collective achievements.
Rewards and Benefits
We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.
