What You'll Be Doing
Build and run Ansys Mechanical models that simulate semiconductor manufacturing processes like deposition, etching, bonding, and thermal cycling
Perform structural and thermal-mechanical analyses to investigate stress, deformation, heat transfer, and failure modes in semiconductor devices and packaging
Evaluate simulation results for accuracy and physical relevance, troubleshooting convergence issues and refining meshes and material models as needed
Support the development of reusable simulation workflows and templates that can be applied across different process scenarios
Document your setup, assumptions, results, and findings in technical reports that help the team understand what works and what needs refinement
Collaborate with engineers and researchers to align simulation objectives with real-world process challenges
The Impact You Will Have
Your models will help predict and prevent failures in semiconductor manufacturing before they reach the fab
The workflows you develop will accelerate future simulation work, making it faster for the team to explore new materials and process conditions
Your analysis will contribute to understanding how thermal and mechanical stresses affect chip reliability and yield
The documentation you create will serve as a reference for future interns and engineers working on similar problems
Your work will support the development of simulation capabilities that Synopsys and its customers use to design better, more reliable semiconductors
You will help bridge the gap between academic FEA knowledge and industrial semiconductor process simulation
What You'll Need
Currently enrolled as a 3rd-year undergraduate or above in Mechanical Engineering, Materials Science & Engineering, or a closely related field
Hands-on experience using Ansys Mechanical for structural or thermal analysis, not just coursework but actual project work where you owned the setup and results
Experience applying Ansys Mechanical to semiconductor-related problems, whether in a class project, research lab, or internship
Solid understanding of finite element analysis fundamentals, including structural mechanics, heat transfer, and material behavior
Basic familiarity with semiconductor manufacturing processes is a plus, even if it is from coursework or reading
Experience with thermal-mechanical coupling, nonlinear analysis, fracture mechanics, or delamination modeling is a plus
APDL scripting or Python experience for automating Ansys workflows is a plus
Who You Are
You can look at a simulation result that seems off and figure out whether it is a mesh problem, a boundary condition problem, or a material model problem
You do not just run simulations, you think about what the physics should look like and whether your setup is actually capturing it
You are comfortable asking for clarification when a problem statement is vague, and you can work independently once you understand the goal
You document your work clearly enough that someone else can pick up your model and understand what you did and why
You are genuinely interested in how things break and how to predict it, not just in getting a result that looks good
The Team You'll Be Part Of
Your recruiter will share more about the team structure and mission during the interview process.