Participate in the IC Substrate supplier selection process. Assess and qualify IC Substrate suppliers. Take part in technical and process audits of suppliers as needed.
Lead IC Substrate failure analysis and drive containment, corrective actions, and risk assessment.
Work closely with manufacturing and engineering teams to resolve complex technical issues.
Collaborate with cross-functional teams across the organization. Effectively communicate complex technical concepts and solutions.
Minimum Qualifications
Possess MS degree in Engineering/Chemistry/Material degree or equivalent, plus 15+ years IC Substrate manufacturing experience
Solid understanding and direct experience in IC Substrate and SLP (substrate like PCB), mSAP process (modified semi-additive process) design specifications and requirements, qualification, manufacturing fabrication and test.
Competency in failure analysis techniques such as FMEA, 8D/Corrective Action, Fishbone IFD, Cause and Effect Analysis, Design of Experiments (DOE), and risk assessment.
Experienced in managing supplier relationships and implementing corrective actions and rigorous quality control measures to ensure product standards and reliability are consistently met.
Preferred Qualifications
Strong problem solving and conflict resolution skills along with customer focus, decision-making, influencing and ability to meet deadlines.
Familiarity of IC Substrate materials (laminates and resins), Signal Integrity, reliability knowledge, and experience.
Lead multiple technical projects and manage day-to-day work while also focusing on long term goals
Focused on teamwork and collaboration, participating in and leading cross organizational projects.
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