Perform advanced physical failure analysis using SEM, FIB, EDS, SAM, cross-sectioning, and related techniques to identify failure mechanisms in silicon, packaging, and interconnects
Apply physics-of-failure principles and deep knowledge of semiconductor failure modes (electromigration, thermal fatigue, delamination, EOS/ESD, solder joint fatigue, etc.) to determine root causes
Drive corrective actions by working directly with silicon design, packaging, and manufacturing teams to implement and validate design or process changes based on FA findings
Author detailed technical reports documenting failure modes, root cause conclusions, supporting data, and corrective action effectiveness
Develop and improve failure analysis techniques and workflows to support new packaging technologies and advanced materials
BASIC QUALIFICATIONS
Bachelor’s degree in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline
5+ years of hands-on experience in microelectronics failure analysis or materials characterization (internship experience is applicable)
PREFERRED SKILLS AND EXPERIENCE
Master’s or PhD in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline with a focus on microelectronics or failure analysis
10+ years of hands-on experience in microelectronics failure analysis or materials characterization
Direct experience with failure analysis tools and techniques (SEM, FIB, EDS, cross-sectioning, fault isolation, or equivalent)
Strong understanding of semiconductor physics and common microelectronics failure mechanisms (electromigration, thermal fatigue, delamination, solder joint fatigue, electrical overstress/ESD, etc.)
Proficiency with advanced FA tools including SEM, FIB, SAM, and EDS
Hands-on experience in electrical characterization and fault isolation techniques such as IV curves, RF/VNA measurement, LIT, OBIRCH, EBIRCH, EBAC, nanoprobing, photon emission, or voltage contrast
Experience applying JEDEC and AEC reliability test standards and physics-of-failure methodologies to root cause investigations
Experience analyzing complex datasets with Python, JMP, or similar tools
Excellent problem-solving, communication, and technical writing skills
ADDITIONAL REQUIREMENTS
Ability to work overtime and weekends as needed
Ability to work in a cleanroom or ESD-controlled environment when required
ITAR REQUIREMENTS
To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.
