Key Responsibilities
Technology Development & NTI
Lead New Technology Introduction (NTI) activities for advanced RF SiP packaging platforms.
Develop process roadmaps and technology strategies to support future RF module and SiP product requirements.
Evaluate and introduce innovative assembly, interconnect, molding, substrate, shielding, and packaging technologies.
Drive Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Reliability (DFR) initiatives during product development.
Partner with cross-functional teams to ensure seamless transition from technology development into production.
Package Process Development
Own development and optimization of RF SiP assembly processes, including:
Die Attach
Flip Chip Assembly
Wire Bonding
Wafer-Level Packaging Integration
Underfill
Encapsulation/Molding
Shielding Processes
SMT and Board-Level Assembly
Define process windows, critical process parameters, and control methodologies.
Lead DOE (Design of Experiments), process characterization, root cause analysis, and yield improvement initiatives.
Establish process specifications, qualification plans, and manufacturing standards.
Manufacturing Readiness & Production Transfer
Drive process development activities from concept through production release.
Lead pilot builds, engineering builds, process qualification, and production ramp readiness assessments.
Develop process control plans and monitoring strategies to ensure consistent manufacturing performance.
Work closely with OSATs, subcontractors, equipment vendors, and manufacturing partners to implement scalable production solutions.
Support factory transfer and production ramp-up activities.
Reliability & Quality
Partner with reliability and quality engineering teams to ensure package/process robustness.
Define package qualification requirements and reliability stress test plans.
Lead failure analysis investigations and corrective action implementation.
Ensure compliance with customer, industry, and regulatory reliability requirements.
Leadership & Team Development
Build and lead a high-performing package process development team.
Provide technical mentorship and career development for engineers.
Foster a culture of innovation, accountability, and continuous improvement.
Coordinate activities across global engineering, manufacturing, and supplier organizations.
Required Qualifications
MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
12+ years of semiconductor packaging experience with at least 3 years in a technical leadership or management role.
Strong hands-on experience in RF SiP package development and assembly process engineering.
Proven track record of successfully launching new package technologies into mass production.
Deep understanding of semiconductor package assembly processes and equipment.
Experience with NTI programs and technology transfer to manufacturing.
Strong knowledge of statistical process control, DOE, FMEA, SPC, and process qualification methodologies.
Experience working with OSATs and external manufacturing partners.
Excellent problem-solving, communication, and cross-functional leadership skills.
Desired Experience and Skills
Extensive experience with RF front-end modules, wireless communication products, or advanced SiP technologies.
Knowledge of RF performance impacts associated with package structures and assembly processes.
Experience with advanced packaging technologies such as
Fan-Out Packaging
Wafer-Level Packaging (WLP)
Panel-Level Packaging (PLP)
Heterogeneous Integration
Multi-Chip Modules (MCM)
Embedded Component Technologies
Strong understanding of package reliability physics and failure mechanisms.
Experience supporting automotive, mobile, Wi-Fi, Bluetooth, GNSS, or cellular RF products.
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The typical base pay range for this role across the U.S. is currently USD $135,900 - $295,000 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.
