Key Responsibilities
Support microelectronics packaging development and manufacturing projects.
Evaluate and characterize packaging materials, including adhesives, mold compounds, substrates, underfills, and thermal interface materials.
Assist with package assembly process development, optimization, and documentation.Conduct laboratory experiments and engineering studies to support product and process improvements.
Collect, analyze, and present technical data to support engineering decisions.
Assist with failure analysis investigations and root cause identification.Support Design of Experiments (DOE) activities and prepare technical reports and presentations.
Create and maintain engineering documentation, test plans, specifications, and work instructions.
Collaborate with cross-functional teams and external OSAT (Outsourced Semiconductor Assembly and Test) partners.
Maintain accurate engineering records and adhere to laboratory safety requirements.
Required Qualifications
Pursuing a Bachelor's or Master's degree in Mechanical Engineering, Chemical Engineering, Materials Science Engineering, Industrial Engineering, Electrical Engineering, or Electronics and Computer Engineering.
Junior or Senior standing, or current graduate student.
Strong analytical, problem-solving, and communication skills.
Proficiency with Microsoft Office applications, particularly Excel, Word, and PowerPoint.
Ability to work independently and collaboratively in a team environment.
Preferred Qualifications
Basic knowledge of semiconductor packaging, materials characterization, manufacturing processes, or failure analysis.
Familiarity with statistical analysis, DOE methodologies, or data analysis tools such as Minitab, JMP, MATLAB, or Python.
Experience with CAD tools such as SolidWorks, Creo, or AutoCAD.
Interest in semiconductor manufacturing and global supplier collaboration.
What You'll Gain
Hands-on experience with advanced semiconductor packaging technologies and manufacturing processes.
Exposure to cross-functional product development and supplier collaboration.
Opportunities to develop technical, analytical, and project management skills.
Experience working within the global semiconductor supply chain.
This internship offers an excellent opportunity to contribute to cutting-edge semiconductor packaging projects while gaining practical engineering experience in a collaborative and innovative environment.
The typical pay range for an Engineering intern across the U.S. is currently USD $26.00 - $47.50 per hour and for a Non-Engineering intern across the U.S. is currently USD $22.50 - $42.00 per hour. Starting pay will depend on level of education, the ultimate job duties and requirements, and work location. Skyworks has different pay ranges for different work locations in the U.S.
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.
