5+ years of experience in Far BEOL Process/Module Integration in semiconductor manufacturing + 3+ years of Bonding experience is required. 10+ years of experience in Process/Module Integration highly preferred.
Expert understanding of overall process flow in assigned areas - Demonstrated understanding of the interactions between process and yield, product performance and reliability.
Prior knowledge in fab unit processes (including Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, etc.) highly preferred.
The current base salary range for this role is between $106,000.00 - $145,000.00. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.
Total Rewards
At Samsung Austin Semiconductor, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.
We offer a comprehensive benefits package, including
Medical, dental, and vision insurance
Life insurance and 401(k) matching with immediate vesting
Onsite café(s) and workout facilities
Paid maternity and paternity leave
Paid time off (PTO) + 2 personal holidays and 10 regular holidays
Wellness incentives and MORE
Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.
All positions at Samsung Austin Semiconductor are full-time on-site.
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