About Rivian Rivian is on a mission to keep the world adventurous forever. This goes for the emissions-free Electric Adventure Vehicles we build, and the curious, courageous souls we seek to attract. As a company, we constantly challenge what’s possible, never simply accepting what has always been done. We reframe old problems, seek new solutions and operate comfortably in areas that are unknown. Our backgrounds are diverse, but our team shares a love of the outdoors and a desire to protect it for future generations. Role Summary Reliability is at the core of Electric Adventure Vehicles. This position is in Irvine, CA, at the centre of Rivian’s Engineering and R&D hub. As an Electrical FA Engineer on the Irvine Failure Analysis team, you will play a key role in generating insight through conducting failure analysis investigations using industry-leading low voltage test equipment for proof, diagnostic, breakdown, and preventive maintenance testing for all Rivian products from the vehicle to component level. The Electrical FA Engineer will perform both deep dive and rapid response triage level failure analysis investigations, specializing in the low voltage electrical, silicon level die and modular electronic systems within the vehicles. Responsibilities Be an integral part of the EE failure analysis team in the Irvine FA lab. Work closely with the electrical FA engineers on the team both in Irvine, CA and in the production facility Normal, IL. Perform both deep dive and rapid response triage failure analysis investigations, specializing in the entire vehicle’s modular electronics. Demonstrated hands-on experience with standard electrical test equipment, including digital multimeters (DMMs), bench power supplies, oscilloscopes, LCR meters, insulation resistance (IR) meters, and HiPot testers for basic bring-up and fault isolation. Proficiency using curve tracers / source-measure units (SMUs) and time-domain reflectometry (TDR) for characterization and localization of opens, shorts, and impedance discontinuities. Experience with non-destructive fault isolation on PCBAs and harnesses via probing, continuity and resistance checks, and in-circuit functional verification. Ability to apply thermal and infrared imaging (including lock-in thermography where applicable) to identify hotspots, leakage paths, and overstressed components. Use of 2D X-ray and 3D CT imaging to inspect solder joints, voids, misalignment, bond wires, and internal assembly defects prior to destructive analysis. Experience with scanning acoustic microscopy (C-SAM) for detection of delamination, voiding, and internal package defects. Skilled in visual inspection and optical microscopy (low and high magnification) to document damage, wear, contamination, and manufacturing anomalies. Hands-on use of scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS/EDX) for detailed fractography, surface analysis, and elemental composition. Familiarity with spectroscopic methods such as Fourier-transform infrared (FTIR) spectroscopy for organic and polymeric material identification in electronic assemblies. Experience performing destructive analysis, including mechanical cross-sectioning, mounting, polishing, and etching to reveal internal structures, interfaces, and failure sites. Hands-on background with advanced destructive methods such as focused ion beam (FIB) cross-sectioning, acid decapsulation, die inspection, and die probing for semiconductor and IC-level failures. Experience with dye-and-pry / dye penetrant techniques to reveal open solder joints, cracks, and hidden interfacial defects. Familiarity with basic mechanical and materials testing (e.g., pull/shear of wire bonds, solder joint strength, connector insertion/extraction) as part of root-cause validation. Collaborate with existing engineering teams (e.g. power conversion, power train, battery cell, materials development, etc.) to help define the needs for electronics and battery specific failure analysis, and identify where they may need help in development of manufacturing processes, or validation of predictive models, etc. Maintain a constant dialogue on the existing and growing capabilities of the FA team. Perform failure analysis activities for incidents originating from reliability testing for new product development and from fielded systems. Assure that root cause is identified at the most detailed level. Prepare failure analysis reports with exceptional visualizations and direct the communication and presentation of findings to project teams and at executive reviews. Work with reliability engineering and testing to recreate failure modes that are intermittent or hard to replicate. Utilize environmental testing equipment, HALT and other methods to be able to precipitate failures as a precursor to in depth failure analysis. Use results to field and the best path in terms of addressing the finding with the cross functional teams. When applicable, travel to support field failure analyses and other work-related activities. Estimated travel is less than 10% annually. Qualifications BS/MS in Electrical Engineering and 5/2+ years relevant industrial experience, preferably in the automotive industry. Strong academic background and/or experience in the testing and analysis of EE components. ● Experience performing failure analysis investigations is required. Hands on experience with the application of, and hands on use of, metrology equipment such as oscilloscopes, optical microscopy, parametric and signal analyzers, etc. for use in detailed failure analysis. Hands on experience with other materials characterization equipment such as optical microscopes, scanning electron microscopes (SEM), energy dispersive spectroscopy (EDS), cross sectioning equipment, decapsulating chemicals, CT-scanning, 2D X-ray, etc. is desirable. Experience of preparing formal reports summarizing analysis data and results. A desire to create a respectful, fun, inclusive and inspiring team and company culture is a must. Preferred Experience: Hands‑on semiconductor device failure analysis across power and low‑voltage ICs (e.g., MOSFETs, IGBTs, gate drivers, MCUs, ASICs, sensors). Experience with semiconductor fault isolation techniques such as LIT, OBIRCH, TIVA/LIVA, emission microscopy, and laser‑based localization, with the ability to select methods appropriate to the failure mode. Experience with die‑level and package‑level CAD/layout tools and data (e.g., GDS, ODB++, bonding and leadframe drawings) to correlate physical/FA observations with design intent and identify suspect nets or structures. Proficiency with electrical characterization and debug techniques: parametric testing, curve tracing, TLP/HBM/IEC ESD testing, latch‑up, and thermal characterization. Experience with physical analysis methods: cross‑sectioning, polishing (die-level), decapsulation (wet/plasma), optical microscopy, SEM/EDX; familiarity with FIB, TEM Demonstrated ability to perform systematic root‑cause analysis linking device‑level failure mechanisms (e.g., EOS/ESD, TDDB, HCI, electromigration, corrosion) to circuit and system behavior. Pay Disclosure The salary range for this role is $77,800 - $97,300 for California based applicants. This is the lowest to highest salary we in good faith believe we would pay for this role at the time of this posting. An employee’s position within the salary range will be based on several factors including, but not limited to, specific competencies, relevant education, qualifications, certifications, experience, skills, geographic location, shift, and organizational needs. The successful candidate may be eligible for annual performance bonus and equity awards. We offer a comprehensive package of benefits for full-time and part-time employees, their spouse or domestic partner, and children up to age 26, including but not limited to paid vacation, paid sick leave, and a competitive portfolio of insurance benefits including life, medical, dental, vision, short-term disability insurance, and long-term disability insurance to eligible employees. You may also have the opportunity to participate in Rivian’s 401(k) Plan and Employee Stock Purchase Program if you meet certain eligibility requirements. Full-time employee coverage is effective on their first day of employment. Part-time employee coverage is effective the first of the month following 90 days of employment. More information about benefits is available at rivianbenefits.com. You can apply for this role through careers.rivian.com (or through internal-careers-rivian.icims.com if you are a current employee). There is no fixed deadline for this application; applications are accepted on an ongoing basis until the role is filled or the opening is no longer needed. Equal Opportunity Rivian is an equal opportunity employer and complies with all applicable federal, state, and local fair employment practices laws. All qualified applicants will receive consideration for employment without regard to race, color, religion, national origin, ancestry, sex, sexual orientation, gender, gender expression, gender identity, genetic information or characteristics, physical or mental disability, marital/domestic partner status, age, military/veteran status, medical condition, or any other characteristic protected by law. Rivian is committed to ensuring that our hiring process is accessible for persons with disabilities. If you have a disability or limitation, such as those covered by the Americans with Disabilities Act, that requires accommodations to assist you in the search and application process, please email us at candidateaccommodations@rivian.com. Candidate Data Privacy and Technology Rivian may collect, use and disclose your personal information or personal data (within the meaning of the applicable data protection laws) when you apply for employment and/or participate in our recruitment processes (“Candidate Personal Data”). This data includes contact, demographic, communications, educational, professional, employment, social media/website, network/device, recruiting system usage/interaction, security and preference information. Rivian may use your Candidate Personal Data for the purposes of (i) tracking interactions with our recruiting system; (ii) carrying out, analyzing and improving our application and recruitment process, including assessing you and your application and conducting employment, background and reference checks; (iii) establishing an employment relationship or entering into an employment contract with you; (iv) complying with our legal, regulatory and corporate governance obligations; (v) recordkeeping; (vi) ensuring network and information security and preventing fraud; and (vii) as otherwise required or permitted by applicable law. Rivian may share your Candidate Personal Data with (i) internal personnel who have a need to know such information in order to perform their duties, including individuals on our People Team, Finance, Legal, and the team(s) with the position(s) for which you are applying; (ii) Rivian affiliates; and (iii) Rivian’s service providers, including providers of background checks, staffing services, and cloud services. Rivian may transfer or store internationally your Candidate Personal Data, including to or in the United States, Canada, the United Kingdom, and the European Union and in the cloud, and this data may be subject to the laws and accessible to the courts, law enforcement and national security authorities of such jurisdictions. How We Use AI in Our Hiring Process: To ensure transparency, we want candidates to know that Rivian uses iCIMS Talent Cloud Artificial Intelligence (TCAI) and AI-enabled tools to assist with screening, reviewing, organizing and highlighting profiles and applications that match the key requirements for each role. AI does not make hiring decisions: Qualified candidate applications are reviewed by a member of our team, and all decisions throughout the process are made by humans. We use AI to support efficiency and consistency, not to replace human judgment. We are committed to a fair, thoughtful, and equitable experience for every candidate. Participation in AI profile matching is entirely voluntary. If you prefer that your profile not be used in this process, you can opt out at any time. Opting out means your profile will be excluded from automated matching and will not be surfaced for additional roles through this system. Your current application remains active and will not be affected in any way. Interview Integrity & AI Policy Our interview process is designed to evaluate your personal technical foundation, real-time problem-solving logic, and structured capabilities. Therefore, the use of assistive generative AI tools to formulate or deliver your solutions during live interview sessions is not permitted. We care most about how you think — how you make sense of unclear requirements, weigh trade-offs, and explain why you chose one approach over another. We value your unique human perspective, your authenticity, and the journey it takes to reach a solution. Please note that we are currently not accepting applications from third party application services. Be an integral part of the EE failure analysis team in the Irvine FA lab. Work closely with the electrical FA engineers on the team both in Irvine, CA and in the production facility Normal, IL. Perform both deep dive and rapid response triage failure analysis investigations, specializing in the entire vehicle’s modular electronics. Demonstrated hands-on experience with standard electrical test equipment, including digital multimeters (DMMs), bench power supplies, oscilloscopes, LCR meters, insulation resistance (IR) meters, and HiPot testers for basic bring-up and fault isolation. Proficiency using curve tracers / source-measure units (SMUs) and time-domain reflectometry (TDR) for characterization and localization of opens, shorts, and impedance discontinuities. Experience with non-destructive fault isolation on PCBAs and harnesses via probing, continuity and resistance checks, and in-circuit functional verification. Ability to apply thermal and infrared imaging (including lock-in thermography where applicable) to identify hotspots, leakage paths, and overstressed components. Use of 2D X-ray and 3D CT imaging to inspect solder joints, voids, misalignment, bond wires, and internal assembly defects prior to destructive analysis. Experience with scanning acoustic microscopy (C-SAM) for detection of delamination, voiding, and internal package defects. Skilled in visual inspection and optical microscopy (low and high magnification) to document damage, wear, contamination, and manufacturing anomalies. Hands-on use of scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS/EDX) for detailed fractography, surface analysis, and elemental composition. Familiarity with spectroscopic methods such as Fourier-transform infrared (FTIR) spectroscopy for organic and polymeric material identification in electronic assemblies. Experience performing destructive analysis, including mechanical cross-sectioning, mounting, polishing, and etching to reveal internal structures, interfaces, and failure sites. Hands-on background with advanced destructive methods such as focused ion beam (FIB) cross-sectioning, acid decapsulation, die inspection, and die probing for semiconductor and IC-level failures. Experience with dye-and-pry / dye penetrant techniques to reveal open solder joints, cracks, and hidden interfacial defects. Familiarity with basic mechanical and materials testing (e.g., pull/shear of wire bonds, solder joint strength, connector insertion/extraction) as part of root-cause validation. Collaborate with existing engineering teams (e.g. power conversion, power train, battery cell, materials development, etc.) to help define the needs for electronics and battery specific failure analysis, and identify where they may need help in development of manufacturing processes, or validation of predictive models, etc. Maintain a constant dialogue on the existing and growing capabilities of the FA team. Perform failure analysis activities for incidents originating from reliability testing for new product development and from fielded systems. Assure that root cause is identified at the most detailed level. Prepare failure analysis reports with exceptional visualizations and direct the communication and presentation of findings to project teams and at executive reviews. Work with reliability engineering and testing to recreate failure modes that are intermittent or hard to replicate. Utilize environmental testing equipment, HALT and other methods to be able to precipitate failures as a precursor to in depth failure analysis. Use results to field and the best path in terms of addressing the finding with the cross functional teams. When applicable, travel to support field failure analyses and other work-related activities. Estimated travel is less than 10% annually. BS/MS in Electrical Engineering and 5/2+ years relevant industrial experience, preferably in the automotive industry. Strong academic background and/or experience in the testing and analysis of EE components. ● Experience performing failure analysis investigations is required. Hands on experience with the application of, and hands on use of, metrology equipment such as oscilloscopes, optical microscopy, parametric and signal analyzers, etc. for use in detailed failure analysis. Hands on experience with other materials characterization equipment such as optical microscopes, scanning electron microscopes (SEM), energy dispersive spectroscopy (EDS), cross sectioning equipment, decapsulating chemicals, CT-scanning, 2D X-ray, etc. is desirable. Experience of preparing formal reports summarizing analysis data and results. A desire to create a respectful, fun, inclusive and inspiring team and company culture is a must. Preferred Experience: Hands‑on semiconductor device failure analysis across power and low‑voltage ICs (e.g., MOSFETs, IGBTs, gate drivers, MCUs, ASICs, sensors). Experience with semiconductor fault isolation techniques such as LIT, OBIRCH, TIVA/LIVA, emission microscopy, and laser‑based localization, with the ability to select methods appropriate to the failure mode. Experience with die‑level and package‑level CAD/layout tools and data (e.g., GDS, ODB++, bonding and leadframe drawings) to correlate physical/FA observations with design intent and identify suspect nets or structures. Proficiency with electrical characterization and debug techniques: parametric testing, curve tracing, TLP/HBM/IEC ESD testing, latch‑up, and thermal characterization. Experience with physical analysis methods: cross‑sectioning, polishing (die-level), decapsulation (wet/plasma), optical microscopy, SEM/EDX; familiarity with FIB, TEM Demonstrated ability to perform systematic root‑cause analysis linking device‑level failure mechanisms (e.g., EOS/ESD, TDDB, HCI, electromigration, corrosion) to circuit and system behavior.
