B. Multi-Process Engineering Responsibilities
Resin Tie bar cut - Develop and optimize Resin Tie bar cut process for REXFET
Strip Grinding - Develop and optimize Strip Grinding process for REXFET
Cut Form Mark - Develop and optimize Cut Form Mark and other related process control for Marking & Cutting.
C. Cross-Functional Collaboration
Collaborate with Production, Equipment Eng, QA, Product Eng, Material Eng, and other relevant departments
Work with equipment and material suppliers to evaluate new technologies and improvement opportunities.
Provide technical support during engineering builds, qualification builds, troubleshooting, and production ramp-up.
Coordinate process readiness, material availability, and documentation before qualification and mass production.
D. Documentation and Mass Production Transfer
Prepare and maintain process specifications, SOPs, work instructions, process flow documents, and risk assessments.
Maintain engineering records, process parameter histories, DOE results, and qualification reports.
Support PFMEA reviews and implementation of appropriate process controls.
Define critical-to-quality parameters and monitoring requirements.
Qualifications
Bachelor's Degree in Engineering (Mechanical, Mechatronics, or related disciplines).
Minimum 5 years experience in semiconductor assembly, packaging, or manufacturing engineering is preferred in Marking, Trim & Form and Strip Grinding.
Candidates with relevant experience in multiple assembly processes, particularly power semiconductor or power discrete packaging, will have an added advantage.
Skills and Knowledge
Strong analytical, troubleshooting, and problem-solving skills.
Good understanding of semiconductor assembly processes and process interactions.
Knowledge of DOE, SPC, process capability analysis, FMEA, and structured root cause analysis.
Ability to interpret engineering data, identify process risks, and implement effective corrective actions.
Proficiency in Microsoft Excel and PowerPoint for data analysis, technical reporting, and presentation.
Good communication and cross-functional collaboration skills.
Ability to manage multiple NPI activities and meet project milestones.
Added Advantages
Experience in REXFET, MOSFET, power discrete, or power semiconductor package assembly.
Hands-on experience in Keyence Laser Marker, Excess Resin Cut and Trim & Form processes.
Experience in Marking Program Setup, Machine Vision Inspection, Dieset Maintenance and package failure analysis.
Experience in new product qualification, process transfer, safe launch, and mass production ramp-up.
Experience in process development using DOE and optimization of multi-step assembly processes using JMP analysis tools.
Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
