Key Responsibilities
Lead FA test interface enablement across all Qualcomm product lines, including Mobile, Compute, Automotive, Networking, and AR/VR Embedded platforms.
Proactively plan, develop, and deploy FA‑specific hardware such as custom sockets and carrier boards to support both ATE‑based and platform‑based testing environments.
Define and optimize the minimum viable set of socket and interface variants required to support comprehensive FA test scenarios, ensuring hardware readiness by Silicon on Dock (SOD).
Design, evaluate, and deploy thermal management solutions tailored to FA use cases for high‑power (high‑TDP) devices across Cloud, Compute, and Automotive segments.
Utilize thermal and electrical analysis tools to assess performance, reliability, and feasibility of FA hardware solutions.
Develop detailed hardware specifications and collaborate closely with internal teams and external suppliers to integrate socketing and thermal solutions into the FA workflow.
Partner with cross‑functional teams including Design, Product Engineering, Yield, and Reliability to align FA hardware capabilities with evolving product requirements.
Continuously evaluate emerging technologies and packaging trends to evolve FA interface and socketing strategies.
Preferred Qualifications
Strong foundation in electrical engineering with hands‑on experience in hardware design, test interfaces, or FA enablement.
In‑depth understanding of socketing technologies, power delivery challenges, and signal integrity for advanced semiconductor packages.
Experience supporting FA or debug activities for complex SoCs, high‑pin‑count devices, or large advanced packages.
Familiarity with thermal analysis and mitigation techniques for high‑power semiconductor devices.
Ability to translate FA requirements into clear, actionable hardware specifications.
Strong collaboration and communication skills to work effectively across multidisciplinary and global teams.
Education Requirements
Required: Bachelor’s degree in related discipline.
Preferred: Master’s degree in Electrical Engineering or related discipline
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Pay range and Other Compensation & Benefits
$141,300.00 - $211,900.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
