Principal Duties and Responsibilities
Develops basic features and components of hardware designs in line with product proposals or roadmaps, under the supervision of more experienced engineers.
Applies basic design rules and processes for electronic hardware, equipment, and/or integrated circuitry with minimal supervision from more experienced engineers.
Reads device specification sheets and interprets basic details required to design various hardware features with minimal guidance from more experienced engineers.
Evaluates devices and documents performance over various operating conditions and configurations.
Assists in the assessment of common design features to identify potential flaws (e.g., electrical, mechanical, hardware), compatibility issues, and/or compliance issues under the supervision of more experienced engineers.
Documents basic details about materials, components, chipsets, and assemblies for a device, and records important changes to design with minimal supervision from more experienced engineers.
Troubleshoots basic issues with product designs.
Provides reasonable schedule for own tasks to project lead.
Develops understanding of Qualcomm products.
Work with ODM on joint design, address technical issues and support mass production
Seeks basic knowledge of industry trends, competitor products, and advances in various engineering fields from publicly available information; requires minimal consultation with more experienced engineers to understand and apply advanced concepts.
REQUIRED EXPERIENCE
System/card/rack-level development, including architecture, design, validation, and deployment of enterprise-class hardware platforms. Strengths in any of the following areas:
Rack-Level Expertise
Proven experience in rack-level system integration, including chassis, backplane, cabling, airflow, and thermal management across multiple cards/modules.
Familiarity with rack-scale power delivery, including PDUs, VRMs, PMICs, and power budgeting across multiple boards.
Experience with rack-level diagnostics and bring-up, including debug of interconnects, signal integrity across long traces/cables, and system-level validation.
Understanding of rack-level mechanical constraints, EMI shielding, and compliance with data center deployment standards.
Collaboration with ODMs/OEMs on rack-level design and manufacturing, including review of mechanical drawings, thermal simulations, and compliance testing.
