KEY RESPONSIBILITIES
🔋 Power & Thermal Technical Leadership
Lead troubleshooting of complex Power and Thermal software issues across multiple Snapdragon platforms and OS environments (Android, Linux, QNX, and others).
Provide technical leadership for customer issues involving
Power management features – S2R, Dynamic Sleep / DSQB, PCM, and other low-power modes
Thermal management and TDP workload characterization across product families
Device and subsystem power states (AOP, RPMh, LPASS/ADSP, DSPs, NSP)
Virtual-machine and hypervisor power interactions in multi-OS automotive and compute platforms
Analyse system-wide power management flows across HLOS and non-HLOS components, including Linux, Android, QNX, TrustZone, AOP, DSPs, hypervisor, and platform hardware.
Apply strong knowledge of Linux and Android Power Management frameworks to influence customer application design and investigate power management issues.
Understand and debug the role of hypervisors in automotive and compute power management, including host/guest interactions, VM lifecycle management, resource ownership, and inter-VM power coordination.
🏗️ Architecture & Customer Engagement
Provide power and thermal design recommendations for customer applications, workloads, and system architectures across Snapdragon platform families.
Participate in technical discussions with customers, chipset power teams, thermal systems teams, architecture teams, product managers, and regional CE organizations.
Translate customer requirements into clear internal software, system, and architecture requirements.
Lead root-cause analysis, issue reproduction, log analysis, system characterization, and corrective action planning.
Provide customer-specific software recommendations, patches, workarounds, and implementation guidance.
Represent Qualcomm in technical discussions with customers and Tier-1/Tier-2 partners from initial requirements through feature implementation and product launch.
📊 Characterization & Measurement
Perform power and thermal characterization for platform-specific workloads including AI, multimedia, connectivity, and automotive TDP use cases.
Analyse performance-versus-power behaviour for customer-specific AI networks and platform workloads, including NSP/DSP and HLOS processing pipelines.
Support the development and validation of workload and loading tools, tuning monitoring tools to represent realistic product use cases.
Provide accurate power measurement data and technical analysis to chipset power, PPAT, and thermal systems teams.
Leverage hardware-level data and SoC registers for power characterization, debug, and APDP generation across target platforms.
📚 Knowledge Sharing & Mentorship
Conduct technical training and workshops for customers, partners, CE teams, and internal engineering organizations.
Develop debug guides, architecture documentation, training materials, and reusable technical content on power and thermal topics across OS and platform families.
Mentor and guide junior and early-career engineers on Power and Thermal software, system debugging, customer engagement, and technical analysis.
Influence architecture and feature improvements by providing feedback based on hands-on customer and platform experience.
Scale technical knowledge through creation of reusable diagnostics, debug methodologies, and issue-tracking artifacts applicable across platforms.
MINIMUM QUALIFICATIONS
Education & Experience
B.E./B.Tech in Engineering, Computer Science, Electronics, or related field with 8+ years of Software Applications Engineering, Embedded Systems, or related experience.
OR M.Tech/M.S. in relevant field with 6+ years of experience.
OR Ph.D. in relevant field with 4+ years of experience.
Required Skills
3+ years of experience in a customer-facing technical role.
3+ years of experience with C, C++, Python, or similar programming languages.
3+ years of experience with embedded software debugging and system-level issue resolution.
Strong understanding of Linux or Android Power Management fundamentals.
Hands-on experience troubleshooting embedded software across HLOS and non-HLOS components.
Experience with at least one embedded/real-time OS: Linux, Android, QNX, or another RTOS.
Experience with system suspend, resume, shutdown, wakeup, or low-power features.
Experience working with multitasking operating systems and embedded system architecture.
Experience analysing logs, traces, performance data, and power or thermal measurement results.
Strong written and verbal communication skills.
Demonstrated ability to work effectively with customers and cross-functional engineering teams.
Demonstrated technical leadership, mentoring, and problem-solving skills.
PREFERRED QUALIFICATIONS
Staff-level experience leading complex customer issues across multiple engineering organizations.
Deep understanding of Linux kernel power management frameworks and system suspend/resume flows.
Experience with Qualcomm Snapdragon Power and Thermal software across one or more OS environments: Android, Linux (LV/Yocto), QNX.
Experience with low-power features: S2R, DSQB/Dynamic Sleep, PCM, runtime power management, and power-domain control.
Experience with non-HLOS power management components: TrustZone, AOP, RPMh, power management firmware, and related system services.
Experience with hypervisors and virtualization in automotive or compute embedded systems (e.g., QNX-based MGVM/Flex configurations, Android GVM, multi-OS stacks).
Understanding of host and guest OS power coordination and inter-VM communication protocols.
Experience with BSP, device drivers, kernel subsystems, and embedded system architecture on Snapdragon SoCs.
Experience with power, thermal, and performance characterization of AI, DSP, NSP, or accelerator workloads.
Experience with system stability, suspend/resume reliability, reboot, shutdown, and watchdog debugging.
Experience with customer requirements analysis and translation into internal technical specifications.
Experience creating architecture documentation, debug guides, training materials, and technical workshops.
Experience using debugging and hardware analysis tools
JTAG and TRACE32
Oscilloscopes and Logic analyzers
Kernel tracing and logging tools (ftrace, systrace, perf, etc.)
Performance and power monitoring tools (Trepn, SimplePerf, QPT, etc.)
Understanding of ARM architecture and embedded SoC hardware: clocks, PLLs, GPIO, interrupts, GIC, power domains, regulators, memory, and subsystem power control.
Experience with automotive or compute platforms involving digital cockpit, infotainment, ADAS, AI workloads, or vehicle compute systems.
Experience mentoring engineers and influencing cross-functional architecture or software decisions.
Minimum Qualifications
- Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 4+ years of Software Applications Engineering, Software Development experience, or related work experience.
- OR
- Master's degree in Engineering, Information Systems, Computer Science, or related field and 3+ years of Software Applications Engineering, Software Development experience, or related work experience.
- OR
- PhD in Engineering, Information Systems, Computer Science, or related field and 2+ years of Software Applications Engineering, Software Development experience, or related work experience.
- 2+ years of experience with Programming Language such as C, C++, Java, Python, etc.
- 1+ year of experience with debugging techniques.
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