Key Responsibilities
Set multi-generation rack strategy: Help lead, scope, design and set the architecture and roadmap for rack-scale platforms across generations, balancing performance, TCO, power, thermal, memory, and serviceability.
Own executive ODM/OEM & customer relationships: Be the senior engineering counterpart to ODM/OEM partners and customers — shaping joint roadmaps, design partnerships, and deployment commitments.
Drive thermal & power leadership: Set the liquid-cooling and high-density power strategy (direct-to-chip, CDUs, 2Phase DLC, immersion, high-power busbars) and keep Qualcomm ahead of where the industry is heading.
Own deployment at scale: Ensure rack platforms move from NPI through validation to reliable, high-volume field deployment; institute operations, RAS, and fleet-health practices that scale.
Represent Qualcomm externally: Engage in industry standards (e.g., OCP) and represent the rack platform strategy with customers, partners, and executives.
Align the enterprise: Partner across silicon, software, networking, supply chain, operations, product, and finance to deliver a coherent, buildable, deployable platform strategy.
Minimum Requirements
Education: bachelor’s degree in an approved engineering field — Mechanical, Thermal, HW Engineering (or a closely related engineering discipline). Master’s degree is preferred.
Experience: Around 18+ years in server/data center hardware and rack-scale systems, including 10+ years in engineering leadership — with proven experience leading others.
Server-space rack design (hands-on): 12+ years of direct, hands-on industry experience designing server and rack-level hardware — mechanical/electrical/thermal integration, power distribution, cabling/interconnect, and full rack assembly — not adjacent or purely managerial exposure.
Liquid cooling & emerging trends: Deep working knowledge of direct-to-chip / cold-plate liquid cooling, coolant distribution (CDUs, manifolds, blind-mate connectors), rear-door heat exchangers, and immersion — plus a clear point of view on where high-density thermal, power, and rack trends are heading.
Operations experience: Proven ownership of hardware operations — NPI-to-volume ramp, quality, RAS, serviceability, sustaining engineering, and fleet-health practices for systems running in production.
Deployment experience: Track record taking rack-scale systems from bring-up and integration through validation to at-scale field deployment in real data centers, anticipating fleet-level issues before they happen.
ODM/OEM partnership: Extensive, close working relationships with ODMs and OEMs across the server/rack ecosystem — joint design (JDM), manufacturing readiness, BOM and supply alignment, and executive-level partner management.
Scale & scope: Demonstrated ownership of a rack/platform roadmap or engineering function delivering products deployed at scale with external manufacturing partners and major customers.
Executive influence: Excellent executive communication, negotiation, and cross-organizational leadership; able to align engineering, operations, and business stakeholders on strategy and commitments.
Preferred Qualifications
Deep OCP ecosystem involvement (ORV3 / Open Rack Wide, rack & power working groups) and standards leadership.
Experience building or scaling a data center rack/platform business or function.
Experience with AI/accelerator or GPU rack infrastructure at hyperscale, and with sovereign-AI or neocloud deployments.
Familiarity with high-speed connectivity / SerDes, chiplets, PCIe and Ethernet fabrics, and confidential computing.
What Success Looks Like (First 12 Months)
A published multi-generation rack platform roadmap aligned with silicon, software, and customer commitments.
Executive ODM/OEM and key-customer partnerships operating on a predictable design-and-deploy cadence.
A scaled, high-performing rack systems strategy across cooling technologies, roadmaps and deployment for test and potential scale.
Development of E2E cooling analysis / fluid mechanics processes & tools from Facilities to POD to Rack to SoC.
Minimum Qualifications
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 10+ years of Hardware Engineering or related work experience.
- OR
- Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 9+ years of Hardware Engineering or related work experience.
- OR
- PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 8+ years of Hardware Engineering or related work experience.
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Pay range and Other Compensation & Benefits
$251,700.00 - $377,500.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
