- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
- OR
- Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
- OR
- PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.
Preferred Qualifications
10+ years of industry experience in electronics cooling, with a strong focus on high-performance computing, AI, or data center products.
Experience developing thermal solutions for high-power processors, GPUs, AI accelerators, or advanced compute platforms utilizing air, liquid, or hybrid cooling technologies
Deep understanding of thermal management technologies and design elements, including thermal interface materials (TIMs), heat spreaders, heat sinks, vapor chambers, heat pipes, and forced-air cooling solutions.
Experience with advanced semiconductor packaging technologies, including 2.5D and 3D package architectures; exposure to high-power AI accelerator packaging is highly desirable.
Proficiency in scripting and programming for data analysis, model automation, and tool development using languages such as Python, C/C++, MATLAB, or equivalent.
Strong expertise in computational fluid dynamics (CFD) analysis, with hands-on experience using industry-standard tools such as ANSYS Icepak, Celsius EC, Flotherm, or similar platforms.
Demonstrated ability to design, execute, and analyze thermal validation experiments in a laboratory environment, including hands-on use of airflow, temperature, power, and data-acquisition instrumentation.
Experience correlating simulation models with empirical test results and driving model accuracy improvements throughout the product development lifecycle.
Excellent communication, presentation, and cross-functional collaboration skills, with the ability to influence technical decisions across diverse engineering teams.
Ability to clearly communicate complex technical concepts, analyses, and recommendations to both technical and non-technical audiences.
Familiarity with AI/ML workloads, accelerator architectures, and associated thermal challenges is a plus
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Pay range and Other Compensation & Benefits
$210,000.00 - $315,000.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
