Responsibilities
Lead early PCB architectural trade‑off decisions, evaluating solution options and clearly articulating cost, power, performance, and risk implications in architecture reviews, product councils, and leadership forums.
Set, execute, and own targets for PCB cost, area, and bill of materials while maintaining best‑in‑class power and system performance.
Drive PCB competitiveness across platforms, including layer count and stack‑up minimization, board area and routing efficiency, customer design simplicity, and platform reuse across SKUs and generations.
Provide cross‑functional leadership & establish partnership across chipset systems & architecture, product management, packaging, platform hardware, SI/PI, validation, test, software, and customer engineering to ensure coherent end‑to‑end execution.
Engage with vendors, OEMs, and ODMs to align on early platform and PCB architecture and enable manufacturable, cost‑effective designs.
Establish best practices and execution playbooks for cost‑driven platform and PCB architecture to enable repeatable, scalable execution.
Influence future chipset and platform roadmaps using execution experience and competitive analysis of industry platforms.
Minimum Qualifications
- Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Systems Engineering or related work experience.
- OR
- Master's degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of Systems Engineering or related work experience.
- OR
- PhD in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.
Preferred Qualifications
12+ years of experience in hardware platform architecture and PCB design with a focus on the personal computer (PC) segment.
Strong understanding of PCB architecture fundamentals, including layer drivers, stack‑up trade‑offs, routing density, and cost impacts.
Strong knowledge of power delivery networks (PDN), signal integrity (SI), and power integrity (PI), and how these constraints drive PCB architecture, stack‑up, and layout decisions.
Proven track record of making early architectural decisions that materially impact platform cost, complexity, manufacturability, and scalability.
Ability to clearly articulate PCB design and architectural choices and their impact on cost, power, performance, and manufacturability, and to work with vendors, OEMs, and ODMs to drive scalable, low‑cost strategies across products.
Demonstrated ability to lead and influence across highly matrixed, cross‑functional teams.
Strong communication skills with experience interfacing with senior executives, customers, and cross‑functional leadership teams.
Knowledge of PCB design tools & experience reviewing layouts in partnership with hardware design and layout leads.
Experience with OEM enablement of optimal PCB solutions
Familiarity with state‑of‑the‑art IC, package, and PCB design practices and trade‑offs.
Master’s, Electrical Engineering or Compute Engineering
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Pay range and Other Compensation & Benefits
$197,000.00 - $295,400.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
