Qualcomm
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RF360 Singapore Pte., Ltd.
Engineering Group, Engineering Group > Process Development Engineering
Yield Improvement and Failure Analysis
Own overall Front-End process yield performance and drive continuous yield improvement initiatives.
Perform comprehensive wafer scrap analysis and identify root causes of yield loss through data-driven investigations.
Partner closely with process module engineers, manufacturing, quality, and equipment teams to resolve process-related yield excursions.
Develop and implement effective corrective and preventive actions to eliminate recurrence of process and quality issues.
Lead cross-functional investigations and continuous improvement projects to improve process capability and manufacturing robustness.
Capture lessons learned into organizational knowledge databases to ensure long-term sustainability.
Process Optimization and Development
Design, execute, and analyze Design of Experiments to optimize process conditions and establish robust manufacturing windows.
Evaluate process performance using statistical techniques and advanced quality tools.
Identify opportunities for baseline yield, cycle-time, and cost improvements across Front-End processes.
Support new technology introductions, process qualifications, and industrialization activities.
Process Change Management
Plan, coordinate, and execute process changes through Limited Change Requests, ECNs, and qualification activities.
Assess manufacturing risks associated with process modifications and ensure successful implementation without adverse impact on yield, quality, reliability, or customer requirements.
Monitor post-implementation performance and drive timely closure of action items.
Process Transfer and Production Ramp
Support engineering runs, process flow creation, and manufacturing readiness activities for new products and technologies.
Coordinate required tooling, accessories, documentation, and process setup activities.
Review engineering lot results and ensure smooth transition into volume production.
Monitor initial production performance and drive corrective actions where required.
Cross-Functional Collaboration
Work closely with Technology Development teams in Singapore and other development sites on new industrialization projects.
Provide technical leadership and integration support across process, equipment, manufacturing, quality, and product engineering functions.
Communicate technical findings, risk assessments, and recommendations effectively to management and stakeholders.
Customer Satisfaction
Provide timely initial responses to customer queries.
Drive rapid containment of yield and performance issues.
Ensure customer communications are accurate, complete, and clear.
Close issues and projects within committed timelines through proactive management and without escalation.
Deliver customer commitments on time.
The incumbent will be evaluated based on manufacturing performance, technical execution, cross-functional effectiveness, and compliance discipline.
Achievement of Front-End yield targets and manufacturing output objectives.
Reduction of wafer scraps, process defects, and chronic quality issues.
Improvement in process quality, reliability, cost performance, and process robustness.
Timely completion of yield investigations, root-cause reports, and recommended actions, with target response within 5 working days for major yield or quality excursions.
Successful execution of process optimization and transfer projects according to agreed timelines without compromising quality or product performance.
Timely and effective customer support, including prompt initial response, rapid issue containment, accurate and complete communication, and on-time closure of customer commitments.
Full compliance with CSR, EHS, ESD, 5S, and cleanroom protocol requirements.
Bachelor’s Degree in Electrical Engineering, Electronics Engineering, Materials Engineering, Microelectronics, Semiconductor Engineering, or an equivalent discipline.
Experience in semiconductor wafer fabrication or high-volume electronics manufacturing. Front-End semiconductor process integration experience is highly preferred.
Advantageous Background
Hands-on involvement in new technology introduction, process qualification, industrialization, manufacturing ramp-up, yield enhancement, or process control methodologies.
Technical Competencies
Strong understanding of semiconductor wafer fabrication and process integration principles.
Yield analysis, defect reduction, wafer scrap analysis, and failure investigation capability.
Proficiency in DOE, SPC, FMEA, MSA, process capability analysis, and statistical problem solving.
Structured troubleshooting using DMAIC, 8D, Fishbone, and 5-Whys methodologies.
Leadership and Professional Skills
Strong project management, execution discipline, ownership, and accountability.
Excellent analytical, communication, stakeholder management, and cross-functional collaboration skills.
Self-driven, resourceful, organized, and able to perform effectively in a fast-paced manufacturing environment.
Ability to manage changes effectively while maintaining quality, reliability, and compliance expectations.
Computer and Systems Skills
Proficient in Microsoft Excel, PowerPoint, Word, and engineering data analysis tools.
Experience with SPC systems, manufacturing execution systems, and engineering analysis software is an advantage.
Bachelor's degree in Engineering, Science, or related field.
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If you would like more information about this role, please contact Qualcomm Careers.
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