The candidate will engage with PCB SI Engineers, Electrical Package Modeling Engineers, and on a limited basis with IC designers to find solutions and provide recommendations for optimal modeling and extraction techniques.
The work will also include installation of Applications in Windows & Linux OS, KB articles for developed simulation flows.
Minimum Qualifications
Minimum of bachelor’s degree in electrical engineering with 2+ years of experience for the SI, EM Toolset. Usage/Support with 2+ years’ experience in Development & Debugging techniques using Python, VB Scripting, Perl, C, C++ etc.
Preferred Qualifications
Prior strong Experience in RF/SI Software Applications like Cadence Sigrity, Siemens, Keysight, Agilent, Ansys, Dassault
Exposure to Circuit solvers such as Agilent ADS or AWR, Full-wave EM solvers such as HFSS, Clarity, CST Microwave Studio, PowerSI or SIWave
LPDDR design and analysis High speed serial IO Design and Analysis
Programming skills in Python, Perl, C, C++ or similar languages in additional to primary subject knowledge of SI is essential.
Spreadsheets and similar productivity tools, including scripting VNA or TDR based high frequency measurements.
Strong problem solving/ debugging skills.
Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.
Leadership skills to help direct, prioritize, and clearly set project tasks per schedule.
Communicate milestones and directions to outside team members.
Good verbal and written communication skills
Educational Requirements
Minimum of bachelor’s degree in electrical engineering with equivalent experience
Master's degree is preferred on Electromagnetic theory and Transmission lines, Basic signal and power integrity concepts.
Keywords
ADS, Sigrity, HFSS, Clarity, Signal Integrity (SI) Power Integrity (PI), RF, Python, PDN, PCIe, DDR, SerDes
Minimum Qualifications
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
- OR
- Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
- OR
- PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
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